Spot Check – Automatic Site Inspection at High Magnification to find Process Irregularities and Systematic Defects
16 July 2001 - San Francisco/Wetzlar
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The “Spot Check“ software being presented by Leica Microsystems at Semicon West allows the automation of a task that is currently still performed by operators:
the specific inspection of critical sites on wafers for process irregularities and systematic defects (e.g. caused by reticle/mask).
Defects are detected either in a die-to-die or a die-to-golden image comparison. The die-to-golden image comparison permits the detection of systematic defects, such as false reticle, or defects already on the reticle. Using Spot Check together with the optional ADC-NT software, the defects that are found can be automatically classified. This saves handling time and costs, and substantially steps up productivity.
All usual imaging techniques (bright field, dark field, confocal, UV, DUV and DIC) can be used for defect detection with Spot Check. Spot Check is available for the Leica INS 3000/DUV, Leica INS3300 and Leica LDS3000 systems.
the specific inspection of critical sites on wafers for process irregularities and systematic defects (e.g. caused by reticle/mask).
Defects are detected either in a die-to-die or a die-to-golden image comparison. The die-to-golden image comparison permits the detection of systematic defects, such as false reticle, or defects already on the reticle. Using Spot Check together with the optional ADC-NT software, the defects that are found can be automatically classified. This saves handling time and costs, and substantially steps up productivity.
All usual imaging techniques (bright field, dark field, confocal, UV, DUV and DIC) can be used for defect detection with Spot Check. Spot Check is available for the Leica INS 3000/DUV, Leica INS3300 and Leica LDS3000 systems.
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