Fascinating Solution
16 July 2001 - San Francisco/Wetzlar
/B61E56DFFDCC022AC1256A8D004E2D25/$FILE/Ins3300_pro_b_ks.jpg','PicturePopUp','scrollbars=no,status=no,width=650,height=500' ); void(0) "Leica INS3300")
Leica Microsystems Launches INS3300 DUV AT for 300mm Wafer Inspection
Only 12 months in development, the Leica INS3300 DUV is the most advanced solution for production control of 300mm and 200mm wafers. Besides ultimate flexibility provided by its space-saving design, this modular inspection system sets completely new technological standards and features unsurpassed user-friendliness. And, the Leica INS3300 DUV is 100% compatible with the new 300mm fab line standards.
The Leica INS3300 incorporates a new development of true optical importance. The new DUV AT objective developed by Leica Microsystems (patent pending), offers ultra-high resolution and an exceptionally long life span. Leica Microsystems accomplished this through an innovative design where the individual lens elements of the objective are mounted using a completely new technique. The new DUV AT objective uses special cement-free optics, which ensures extremely long life without sacrificing image quality. Coupled with an autofocus system, the new Leica DUV AT is also capable of producing constantly sharp images in real time.
The Leica INS3300 DUV system has a unique multi-wavelength design with the opportunity to include all applicable imaging modes such as brightfield, darkfield, interference contrast, UV (ultraviolet, 365nm) and DUV (deep ultraviolet, 248nm). The resulting high resolution of 80nm is equivalent to about 1/1000 of a human hair.
Only 12 months in development, the Leica INS3300 DUV is the most advanced solution for production control of 300mm and 200mm wafers. Besides ultimate flexibility provided by its space-saving design, this modular inspection system sets completely new technological standards and features unsurpassed user-friendliness. And, the Leica INS3300 DUV is 100% compatible with the new 300mm fab line standards.
The Leica INS3300 incorporates a new development of true optical importance. The new DUV AT objective developed by Leica Microsystems (patent pending), offers ultra-high resolution and an exceptionally long life span. Leica Microsystems accomplished this through an innovative design where the individual lens elements of the objective are mounted using a completely new technique. The new DUV AT objective uses special cement-free optics, which ensures extremely long life without sacrificing image quality. Coupled with an autofocus system, the new Leica DUV AT is also capable of producing constantly sharp images in real time.
The Leica INS3300 DUV system has a unique multi-wavelength design with the opportunity to include all applicable imaging modes such as brightfield, darkfield, interference contrast, UV (ultraviolet, 365nm) and DUV (deep ultraviolet, 248nm). The resulting high resolution of 80nm is equivalent to about 1/1000 of a human hair.
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