Fascinating Solutions for the Production of 300mm Wafers
16 July 2001 - San Francisco/Wetzlar
/C02510CAF92EC8F2C1256A8D004E680B/$FILE/Wafer_pro_b_ks.jpg','PicturePopUp','scrollbars=no,status=no,width=650,height=500' ); void(0) "General Press Releases")
Leica Microsystems Presents a New Range of Automated and Integrated Technologies for Quality Control at Semicon West 2001 in San Francisco.
San Francisco/Wetzlar. Leica Microsystems is presenting a more extensive range of new systems and technologies for semiconductor fabs than ever before at this year's Semicon West. Ranging from quality control through yield management to automation in wafer production, the solutions enable customers to streamline their fabs for more cost-effective production. Integratable into all fab lines, the systems underline Leica Microsystems' technical competence and its lead in relevant market segments of the Semiconductor Equipment industry.
Specifically, Leica Microsystems will unveil its new, full range of 300mm solutions and revolutionary Deep UV AT optics in Air Space Technology.
Taking only 12 months to develop, the Leica INS3300 DUV is the most advanced solution for production control of 300mm and 200mm wafers. Besides ultimate flexibility provided by its space-saving design, this modular inspection system sets completely new technological standards and features unsurpassed user-friendliness. And, the Leica INS3300 DUV is 100% compatible with the new 300mm fab line standards. Leica is also unveiling its new design of DUV AT optics, which revolutionizes the technology of resolution.
The Leica INS3300 DUV system can generate images in various wavelength ranges, e.g. in ultraviolet (365nm) and deep ultraviolet (248nm). The resulting high resolution of 80nm is equivalent to about 1/1000 of a human hair.
San Francisco/Wetzlar. Leica Microsystems is presenting a more extensive range of new systems and technologies for semiconductor fabs than ever before at this year's Semicon West. Ranging from quality control through yield management to automation in wafer production, the solutions enable customers to streamline their fabs for more cost-effective production. Integratable into all fab lines, the systems underline Leica Microsystems' technical competence and its lead in relevant market segments of the Semiconductor Equipment industry.
Specifically, Leica Microsystems will unveil its new, full range of 300mm solutions and revolutionary Deep UV AT optics in Air Space Technology.
Taking only 12 months to develop, the Leica INS3300 DUV is the most advanced solution for production control of 300mm and 200mm wafers. Besides ultimate flexibility provided by its space-saving design, this modular inspection system sets completely new technological standards and features unsurpassed user-friendliness. And, the Leica INS3300 DUV is 100% compatible with the new 300mm fab line standards. Leica is also unveiling its new design of DUV AT optics, which revolutionizes the technology of resolution.
The Leica INS3300 DUV system can generate images in various wavelength ranges, e.g. in ultraviolet (365nm) and deep ultraviolet (248nm). The resulting high resolution of 80nm is equivalent to about 1/1000 of a human hair.
back
next