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TIC 020

Triple ion beam cutter

Overview

Leica EM TIC020

Triple Ion - Beam Cutter

The TIC020 Triple Ion Beam Cutter for preparation of slope cuts allows accurate and efficient site specific sample preparation for SEM imaging, complementary to the current FIB (Focused Ion Beam) technique. The system features three ion beams with a three axis stage and a viewing microscope. This configuration leads to a time and cost efficient sample preparation procedure with high ROI (Return on Investment).

Key Features

  • Cut high quality cross sections from almost any material
  • Prepare big samples up to 50x50x10mm
  • Minimal mechanical pre-preparation required
  • Self explanatory
  • High milling rate, broad and deep cuts, using triple ion source
  • Simple sample fixture
  • Minimum facility requirements
  • Easy access to wear parts
  • Optical process monitoring
  • High reliability and high throughput
  • Computer controlled

The EM TIC 020 features three individually controlled saddle field ion sources located in one assembly. This assembly is arranged in-plane perpendicular to the sample surface. The three ion beams intersect at the edge of the mask forming a milling sector of 100°. This configuration produces clean polished cross sections suitable for EDS, WDS, Auger and EBSD analysis. The milled cross section can reach a cutting depth of >1mm and several mm in width. Due to the milling power of the three ion source short process times are achieved. Depending on the requirements of the sample material, the sources may be operated over a wide range of ion energy (2keV to 8keV).