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Semiconductor Testing, Assembly, and Packaging

Your role in semiconductor testing, assembly, and packaging is critical and requires individualized microscope imaging and analysis solutions to help you test, analyze, and document your work while ensuring the highest level of accuracy. Your end product reliability is a core concern and Leica Microsystems can help you find and correct defects throughout your manufacturing process.

Learn more about high resolution, ergonomic, and affordable microscopy solutions for semiconductor wafer test, assembly and packaging below:

Contact Us For Personal Support

Please contact us if you would like to have personal expert advice on our microscopy solutions for semiconductor wafer testing, assembly, and packaging.


Wafer Test

Optimize your wafer test, assembly and packaging workflow with easy-to-use macro and micro viewing options featured in Leica Microsystems Semiconductor microscopy solutions. Combined with Leica Application Suite imaging and documentation software, our systems make it easy to view, acquire, analyze, document, report and archive your results.

Top Stereomicroscope Solution

Leica M205 A stereomicroscope for Semiconductor Wafer Testing

The Semiconductor Wafer Testing stereomicroscope, Leica M205 A, provides a modular and powerful solution for imaging structural details down to 952 nm. Featuring Leica FusionOptics, this package combines high resolution and depth of field together for ideal 3D optical imaging. Package includes: Leica M205 A with Ergo Trinoc tube, Leica LED5000 SLI or RL illumination, Leica MC170 HD digital camera,  Leica Application Suite microscope imaging software, and LAS modules: LAS Montage, Live Image Builder, Extended Annotation.

Top Compound Solution

Leica DM8000 M upright microscope for Semiconductor Wafer Testing

The Leica DM8000 M Semiconductor Testing compound microscope assists you in delivering fast and accurate results for inspection, process control, and defect analysis of wafers. Paired with a wafer loader system, this solution leverages various illumination and optics technologies to maximize your productivity and results. Solution includes: Leica DM8000 M,  C&D Wafer Loader, Brightfield, Darkfield, and Oblique Ultra Violet illumination, Leica DFC450 digital microscope camera, Leica Application suite and LAS modules: Montage, Multistep, Image Analysis, Interactive Measurement, Leica MAP.

Top Digital Solution

Leica DVM6 digital microscope for Semiconductor Testing

The Leica DVM6 Semiconductor Wafer Testing digital microscope combines Leica Application Suite X (LAS X) software, an integrated 10-megapixel digital camera, different integrated illumination options and outstanding optics for precise, effective digital microscopy. The integrated illumination options include segmented ring light and coaxial illumination, each individually controllable for best imaging results. This versatile imaging system is configurable to your needs - whether you need a cost-effective entry-level solution or a high performance 3D imaging and analysis tool.
Premium software package includes: image capture and image management, 2D measuring and annotations, images with high depth of field, autofocus function, multi-focus images with 3D view and 3D measurement, automatic XY panoramas in 2D and 3D.

Test and Burn-in

Optimize your workflow productivity with Leica Microsystems' microscope solutions for Semiconductor test and burn-in. Combined with LAS software and high-definition camera, these solutions make it easy to analyze and document results.

Top Stereomicroscope Solution

Leica M205 A stereomicroscope for Semiconductor Test and Burn-in

The Leica M205 A Semiconductor Test & Burn in stereomicroscope is a modular and powerful solution for imaging with an optical resolution of 952 nm. This package combines high resolution and depth of field together for ideal 3D optical imaging with Leica FusionOptics. Package includes: Leica M205 A with Trinocular ErgoTube, Leica LED5000 SLI or RL illumination, Leica MC170 HD digital camera, Leica Application Suite microscope imaging software, and LAS modules: LAS Montage, Live Image Builder, Extended Annotation.

Top Compound Solution

Leica DM8000 M upright microscope for Semiconductor Test and Burn-in

The Leica DM8000 M Semiconductor Test and Burn-in compound microscope with wafer loader assists you in delivering fast and accurate results for inspection, process control, and defect analysis of wafers. This solution leverages various illumination and optics technologies to maximize your productivity and results. Solution includes: Leica DM8000 M,  Brightfield, Darkfield, and Oblique Ultra Violet illumination, Leica DFC450 digital microscope camera, Leica Application suite and LAS modules: Montage, Live Image Builder, and Extended Annotation

Top Confocal/Interferometry Solution

Achieve high speed, accurate and repeatable surface measurements with the Leica DCM8. Thanks to the all-in-one solution of confocal microscopy and interferometry a wide variety of samples can be analyzed thus helping to improve efficiency. Thanks to the easy to use software, any operator can perform surface characterization with minimal training. Solution includes: Sensor head for standard and confocal microscopy, VSI, PSI and ePSI interferometry, manual or motorized nosepiece, PC controller and 27” monitor, integrated HD CCD camera, LED illumination (red, green, blue, white), LeicaScan software.