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Semiconductor Wafer Manufacturing

Semiconductor Wafer Manufacturing requires highly precise, fast microscope imaging and handling solutions to assemble, inspect, measure, detect and analyze defects, and document - while assuring the highest level of accuracy and cleanliness for excellent quality end products. In addition to high optical resolution, improve production efficiency and reduce strain on the body from repetitive tasks using Leica Microsystems' extensive line of ergonomic stereo microscopes and compound microscopes.

Learn more about high resolution, ergonomic, and affordable microscopy solutions for wafer handling and inspection below:

Contact Us For Personal Support

Please contact us if you would like to have personal expert advice on our microscopy solutions for semiconductor wafer manufacturing.


Research & Development

See and analyze more detail while improving workflow efficiency with advanced microscopy solutions for Semiconductor Wafer Research and Development from Leica Microsystems. Offering the most versatile imaging solutions for front end inspection and review tasks, Leica Microsystems provides automated features, a variety of contrast methods, easy switching from macro/micro view, along with affordable Oblique Ultraviolet (OUV) illumination.

Top Compound Solution

Leica DM8000 M upright microscope for Semiconductor Wafer Research and Development

Deliver fast, accurate results during wafer inspection, process control, and defect analysis with Semiconductor Wafer Research and Development compound microscopes - The Leica DM8000M and DM12000 M solutions offer the latest illumination and optical technologies to increase yield significantly. Solution includes: Leica DM8000 M Compound Microscope;  Brightfield, Darkfield, and Oblique Ultra Violet illumination; Leica DFC450 Digital Microscope Camera; Leica Application Suite (LAS) Microscope Imaging and Analysis Software; and the LAS Modules Montage, Multistep, Image Analysis, Interactive Measurement, and Leica MAP for Surface Imaging and Metrology.

Top Confocal/Interferometry Solution

The Leica DCM8 offers high speed, accurate and repeatable surface measurements. Operators can work more efficiently thanks to the all-in-one solution of confocal microscopy and interferometry. A variety of measurements can be done with amazing accuracy thus achieving better quality products. Thanks to our intuitive software, any operator can attain nanometer resolution surface characterization with minimal training. Solution includes: Sensor head for standard and confocal microscopy, VSI, PSI and ePSI interferometry, manual or motorized nosepiece, PC controller and 27” monitor, integrated HD CCD camera, LED illumination (red, green, blue, white), LeicaScan software.

Inspection & Measurement

Experience the efficiency of powerful workflow automation and the ability to quickly switch between macro and micro views for wafer inspection. Leica Microsystems' semiconductor microscope imaging solutions can reduce the time it takes for wafer inspection, analysis, and results documentation.

Top Stereomicroscope Solution

Leica M165 C stereomicroscope for Semiconductor Wafer Inspection and Measurement

Improve and simplify your inspection workflow with the Leica M165 C Semiconductor Wafer Inspection & Measurement stereomicroscope; the world’s first encoded stereomicroscope with fully apochromatic-corrected zoom optics. With 16.5:1 zoom and maximum 906 lp/mm resolution, this solution empowers you to view the smallest details of a sample with superb 3D viewing and macro to micro viewing at the touch of a button. Solution includes: Leica M165 C,  Leica Application Suite microscope imaging software, and LAS modules: Montage, Multistep, Image Analysis, Interactive Measurement, Leica MAP.

Top Compound Solution

Leica DM8000 M upright microscope for Semiconductor Wafer Inspection and Measurement

The Leica DM8000 M Semiconductor Wafer Inspection and Measurement compound microscope system assists you in delivering fast and accurate results for inspection, process control, and defect analysis of wafers.  Paired with a wafer loader system, this solution leverages various illumination and optics technologies to maximize your productivity and results.  Solution includes: Leica DM8000 M, C&D Wafer Loader,  Brightfield, Darkfield, and Oblique Ultra Violet illumination, Leica DFC450 digital microscope camera, Leica Application Suite microscope imaging software and LAS modules: Montage, Multistep, Image Analysis, Interactive Measurement, and Leica MAP.

Top Digital Solution

Leica DVM6 digital microscope for Semiconductor Wafer Inspection and Measurement

The Leica DVM6 Semiconductor Wafer Inspection & Measurement digital microscope works with Leica Application Suite X (LAS X) software, an integrated 10-megapixel digital camera and outstanding optics for precise, effective digital microscopy. The integrated illumination options include segmented ring light and coaxial illumination, each individually controllable for best imaging results. This flexible digital microscope is configurable to your needs - providing cost-effective entry-level solutions to high performing 3D imaging and analysis tools.
Premium software package includes: image capture and image management, 2D measuring and annotations, images with high depth of field, autofocus function, multi-focus images with 3D view and 3D measurement, automatic XY panoramas in 2D and 3D.