International Symposium for Testing and Failure Analysis 2009

ISTFA 2009’s theme is “It’s all About Resolution”. The Electronic Device Failure Analysis Society (EDFAS) fosters education and communication in the failure analysis community, working for technology advancement and the improved performance and reliability of devices and materials for the electronic industry.

Visit Leica Microsystems' booth #327 to view the most comprehensive product portfolio for electron microscopy sample preparation.

The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques. An integrated stereomicroscope allows pinpointing and easy preparation of barely visible targets; with the specimen pivot arm the sample can be observed directly at an angle between 0° and 60°, or 90° to the front face for distance determination with an eyepiece graticule.

The Leica RES101 is a fully computer-controlled ion milling system with the highest level of user flexibility, which combines the preparation of TEM, SEM, and LM samples in one bench-top instrument. The Leica RES101 offers a variable milling angle from 0° to 90° and variable ion energy for high and low energy milling processes. Sample observation is possible at all times with the built-in CCD camera. A load lock system enables permanent high vacuum.