Applications Leica EM RES101
Ion polished Cross Section of Gold Wire Bonding
03 August 2009
Market: Microelectronics QA/Research
This Application Note describes the preparation method
"Ion polished Cross Section of Gold Wire bonding -
Quality enhancement after mechanical polishing"
using the Leica EM RES101
Cross Section of a Solder Ball on a Cu/Ni Pad
03 August 2009
Market: Microelectronics QA/Research
This Application Note describes the preparation method
"Cross Section of a Solder Ball on a CU/Ni pad"
using the Leica EM RES101.
Ion polished Cross Section of IC Gold Wire Bonding
03 August 2009
Market: Microelectronics QA/Research
This Application Note describes the preparation method
"Ion polished Cross Section of IC Gold Wire bonding -
Quality enhancement after mechanical polishing"
using the Leica EM RES101
Cleaning and Ion Polishing of Soft Metals (AgSnCu-Oxide)
03 August 2009
Market: Material Research Institutes, Universities
This Application Note describes the preparation method
"Cleaning and Ion Polishing of Soft Metals
(AgSnCu-Oxide)"
using the Leica EM RES101