News for Leica EM TXP
New Pinpoint Preparation Instrument for SEM, TEM and Industrial Light Microscopy Specimen Preparation
05 July 2007
From diamond cutting and milling to polishing: On one instrument, the Leica EM TXP.
The Automated Leica EM TXP Saws, Mills, Grinds, and Polishes
Vienna, Austria. The Leica EM TXP, a one-of-a-kind precision instrument for preparing cross sections, unites four machining technologies in one instrument. The new all-around instrument from Leica Microsystems saws, mills, grinds, and polishes material specimens for scanning electron microscopy (SEM) and incident light microscopy. For example, quick and accurate pinpoint preparation of microelectronic gold bonding wires in semiconductor chips is possible without the need to transport the specimen between various instruments.
Time-saving and Reliable Preparation - Always with an Overview
When material specimen surfaces are prepared for SEM or incident light microscopy in industrial quality control, the specimen usually undergoes multiple processes until the layer or surface to be analyzed is machined with precision. Whereas previously, specimens had to be prepared using various instruments, all required machining steps can now be completed – from diamond cutting and milling to polishing – on one instrument, the Leica EM TXP. This reduces not only the amount of time required, but also the risk of losing specimen detail. The Leica EM TXP’s automation gives the user additional support for quick and reliable preparation. All parameters can be preset for each operating step; the instrument then works fully automatically. Another important feature that makes work easier is the integrated stereomicroscope that enables the user to observe the specimen during the entire machining process. There is no longer a need for the laborious process of localizing and examining intermediate results using a separate microscope.
Attain the Best Surface Quality
With the versatile Leica EM TXP, the user can switch between the individual tools just as easily. High-performance tungsten carbide or diamond cutters, diamond saw blades, and a variety of lapping inserts enable surface treatment that is optimally matched to specific specimen properties and yield smooth surfaces of the highest quality. And, the optimized stability of the instrument prevents vibration. A new feature, patent pending, is the integrated feed mechanism that enables precision cutting of both hard and brittle materials. Its versatility makes the Leica EM TXP also suitable as a timesaving tool for preparing for ion beam etching in transmission electron microscopy (TEM).