Showcase Leica BOND-III

Leica BOND-MAX vs Leica BOND-III

	Leica BOND-MAX	Leica BOND-III
Processing module dimensions	703 mm × 760 mm × 775 mm (27.68 in × 29.92 in × 30.51 in)	775 mm x 785 mm x 1,359 mm (30.51 in x 30.91 in x 53.50 in)
Weight (dry)	120 kg (264.6 lb)	246 kg (543 lb)
Processing temperature	Ambient to 100 °C	Ambient to 100°C
Slide capacity	3 independent trays, of 10 slides, 30 slide total capacity	3 independent trays of 10 slides, 30 slides total capacity
Reagent container capacity	7 mL or 30 mL	7 mL or 30 mL
Number of reagent containers	36 (4 trays of 9)	36 (4 trays of 9)
Dispense volume	100 μL or 150 μL	150 μL
Modularity	5 processing modules per controlling PC	5 processing modules per controlling PC. Any combination of BOND-x™, BOND-Max™ and BOND-III
Waste disposal	Separation of hazardous and nonhazardous waste	Separation of hazardous and nonhazardous waste
System mounting	Bench mounted or freestanding	Freestanding
Database	Full tracking and reporting of all slides	Full tracking and reporting of all slides Full tracking and traceability of reagent lot numbers, expiration dates and usage
Laboratory information system (LIS) integration	Optional upgrade package compatible with ASTM and HL7	Optional upgrade package, compatible with HL7 v2.4/2.5 and LIS02-A2 (ASTM 1394)