Application Note for Leica TIC 3X - High quality sample preparation of large area to investigate the sample in the SEM. For the mechanical preparation step diamond lapping foils of 9μm subsequently 2μm and finally 0.5μm grain size were used. It took about 1.5 hours. The sample was removed from the stub with a razor blade after TXP processing and fixed onto the holder of the rotary stage of the Leica EM TIC 3X.
Application Note for Leica EM TIC 3X - Ion beam slope cutting is a method that can achieve flat cross sections of soft materials or material combinations consisting of hard and soft components. The CuSn connector is very soft. Mechanical polishing leads to smearing.