Cross Sectioning of a Multilayer System - Preparation of a Perfect Sample Surface for EBSD

Application Note for Leica EM TIC 3X - Industrial Manufacturing

December 22, 2016

Electron Backscattered Diffraction (EBSD) is a surface technique creating a diffraction pattern (Kikuchi-bands). It can be used for crystal orientation mapping, defect studies, phase identification, grain boundary studies and morphology studies. The information depth is just a few nm.

Therefore good sample preparation is very important to avoid any damage. This is very difficult in case of multilayer system with big differences in hardness.

Process Description
(benchmark values for this particular sample)
Mechanical pre-preparation with the Leica EM TXP using 9 µm diamond lapping foil at 2600 rpm.

TIC 3X Parameters
Acceleration Voltage7 kV
Gun current2.6 mA
Milling time8h



  • The cross section of the multilayer system looks perfect.
  • Even structural details of solder and its interface structure are clearly visible.
  • The diffraction pattern of different layers prove the preparation quality.
Fig.1: SEM image of copper with overlay of the measured area and the corresponding diffraction pattern
Fig.2: Cross section of a multilayer system for EBSD
Fig.3: Cross section of a multilayer system for EBSD
Fig.4: Band contrast image
Fig.5: Orientation map