Cross Sectioning of a Superconductive Wire

Application Note for Leica EM TIC 3X - Industrial Manufacturing

September 20, 2016

Purpose: The shape of the wire is difficult for ion beam slope cutting.

Goal: Cross sectional preparation to see the structure of the wire.

Process Description: (benchmark values for this particular sample)
Mechanical pre-preparation:
1. Embedding in between two Si slices
2. Grinding the cross section with the Leica EM TXP
    (6µm diamond foil) to get a flat surface

Ion Milling:

Parameter / Step
Acceleration voltage6 kV
Gun current2 mA
Milling time5 h

 

Results:

  • Flat and clean cross section of the superconductive wire
  • Structure of Nb3Sn in the Cu matrix
Fig.1: Cross sectioning - superconductive wire
Fig.2: Cross sectioning - superconductive wire
Fig.3: Cross sectioning - superconductive wire
Fig.4: Cross sectioning - superconductive wire

Comments

Help us to improve the Leica Science Lab and participate in our survey! Start Survey

Arrow Down

Arrow Up