Cross Sectioning of Copper for Electron Backscattered Diffraction (EBSD)

Application Note for Leica EM TIC 3X - Material Research

January 19, 2017

Electron Backscattered Diffraction (EBSD) is a surface technique creating diffraction patterns (Kikuchi-bands). It can be used for crystal orientation mapping, defect studies, phase identification, grain boundary studies and morphological studies. The information depth is just a few nm, therefore good sample preparation is very important to avoid damages.

In this application note we describe how to prepare a perfect sample surface for EBSD.

Process Description
(benchmark values for this particular sample)
Mechanical pre-preparation: with the Leica EM TXP using a tungsten carbide miller of 15000 rpm.

TIC 3X Parameters
Acceleration voltage7 kV
Gun current2.6 mA
Milling time6 h



  • The prepared surface shows the grain structure of copper.
  • An excellent diffraction pattern proves the preparation quality.
Fig.1: orientation map
Fig.2: band contrast image
Fig.3: SEM image of copper with overlay of the measured area and the corresponding diffraction pattern
Fig.4: Cross section (ion beam slope cut) of copper for EBSD