Cross Sectioning of Ni/Cu on Steel for EBSD

Application Note for Leica EM TIC 3X - Material Research

October 14, 2016

Electron Backscattered Diffraction (EBSD) is a surface technique creating a diffraction pattern (Kikuchi-bands). It can be used for crystal orientation mapping, defect studies, phase identification, grain boundary studies and morphology studies. The information depth is just a few nm. Therefore a good sample preparation is very important.

Preparation of a perfect sample surface for EBSD.

Process Description
(benchmark values for this particular sample)
Mechanical pre-preparation with the Leica EM TXP using 9 µm diamond lapping foil at 2600 rpm.

TIC 3X Parameters
Acceleration voltage7 kV
Gun current2.6 mA
Milling time6 h


  • The surface quality is very good.
  • Steel has areas with big grains.
  • The diffraction pattern prooves the preparation quality.
Fig.1: Cross Section of Ni/Cu Son
Fig.2: SEM image with corresponding diffraction patterns
Fig.3: Orientation map
Fig.4: Band contrast image


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