Mechanical polishing can be time consuming and frustrating. It can also introduce unwanted artifacts when preparing cross-sectioned samples for electron backscatter diffraction (EBSD) in the scanning electron microscope (SEM) or light microscope investigation. In contrast, ion beam milling can eliminate undesirable artifacts that will hamper your analysis and interpretation.
In this webinar results from ion beam milled sample preparation of magnesium for EBSD will be shown. A multistep procedure to prepare cross sectional TEM samples of Knoop-indented ceramic armor materials to view the heavily cracked subsurface damage region below the indent will also be shown. Both workflows are performed using the EM TIC3X ion beam milling system at the US Army Research Laboratory at Aberdeen Proving Ground.
Dr. Scott Walck, Senior Scientist with SURVICE Engineering Company
Robert Ranner, Product Manager for EM specimen preparation, Leica Microsystems Nanotechnology Division