Mechanical pre-preparation with the Leica EM TXP:
Diamond foil 9 µm at 2000 rpm to approach the area of interest.
Process has been stopped when the solder ball appeared.
This is roughly 50 µm before the center of the solder ball.
|Sample holder:||90°-slope cutting holder|
|Acceleration voltage:||7 kV|
|Milling time:||4 h|
|Sample movement:||Oscillation (60°)|
With the help of the slope-cut procedure, cross sections could be produced without destroying the original layer structure. The structure of the solder ball is easily recognizable. There is no damage caused by the preparation process.