Revolutionary Stereomicroscopy and Unique Precision Instrument for Surface Preparation
13 November 2007 - Munich, Germany
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Productronica 2007: Innovations for Industrial Quality Control from Leica Microsystems
Whether for inspecting cross sections, viewing surfaces in three dimensions, or recording digital documentation for damage analysis, top microscope resolution and first-class sample surface quality are decisive success factors in industrial quality control. At Productronica 2007, the world’s leading trade fair for the international electronics manufacturing industry, Leica Microsystems is presenting innovative technologies for the quality assurance of circuit boards in the form of the revolutionary stereomicroscopes Leica M205 C and M165 C and the unique precision instrument for sample preparation, the Leica EM TXP.
FusionOptic™ redefines the limits of stereomicroscopy
With the stereomicroscopes Leica M205 C and M165 C, Leica Microsystems has managed to push back the previous barriers of stereomicroscopy. The Leica M205 C is the world's first stereomicroscope with a fully apochromatically corrected 20.5:1 zoom. In the zoom range from 0.78x to 16x, the resolution increases continuously up to 1050 lp/mm (planapochromat objective 2x). Due to the natural laws of optics, this performance class has never been seen before in stereomicroscopes. Up until now, optical attachments could only achieve a maximum zoom range of 16:1 or a magnification increase without an increase in resolution (empty magnification). Leica Microsystems has made advantageous use of a neurological phenomenon by implementing the new Leica FusionOptic™ (patent applied for): with FusionOptic™, the left beam path produces great depth of field, while the right beam path provides a high-resolution image. The human brain then combines the best information from both channels, using it to compose an image whose resolution and depth of field have never been achieved in any stereomicroscope before.
Top quality surface preparation
Leica Microsystems designed the unique Leica EM TXP as an accurate and time-saving method of preparing high-quality material samples. The new automated precision instrument for preparing cross sections unites four machining technologies in one all-around tool that saws, mills, grinds, and polishes material specimens without the need to transport them between various instruments. This reduces not only the amount of time required, but also the risk of losing specimen detail. All parameters can be preset for each operating step, and the instrument then works fully automatically. With the versatile Leica EM TXP, the user can switch between the individual tools just as easily. High-performance tungsten carbide or diamond cutters, diamond saw blades, and a variety of lapping inserts in combination with the integrated cooling lubrication system enable surface treatment that is optimally matched to specific specimen properties and yield smooth surfaces of the highest quality. And, the optimized stability of the instrument prevents vibration.
Robust and intuitive industrial microscope
Combining state-of-the-art standards in optics with reliable and convenient operation, the Leica DM2500 M is the ideal microscope for the inspection of circuit board cross sections and is affordable for small budgets as well. The rugged system microscope accelerates the work routines in industrial quality control. The color-coded field and aperture diaphragm setting allows intuitive operation.
To match these products, Leica Microsystems is also showing trade fair visitors a well thought-out range of cameras, software solutions and accessories to cover the entire process of quality control in semiconductor fab lines.
Whether for inspecting cross sections, viewing surfaces in three dimensions, or recording digital documentation for damage analysis, top microscope resolution and first-class sample surface quality are decisive success factors in industrial quality control. At Productronica 2007, the world’s leading trade fair for the international electronics manufacturing industry, Leica Microsystems is presenting innovative technologies for the quality assurance of circuit boards in the form of the revolutionary stereomicroscopes Leica M205 C and M165 C and the unique precision instrument for sample preparation, the Leica EM TXP.
FusionOptic™ redefines the limits of stereomicroscopy
With the stereomicroscopes Leica M205 C and M165 C, Leica Microsystems has managed to push back the previous barriers of stereomicroscopy. The Leica M205 C is the world's first stereomicroscope with a fully apochromatically corrected 20.5:1 zoom. In the zoom range from 0.78x to 16x, the resolution increases continuously up to 1050 lp/mm (planapochromat objective 2x). Due to the natural laws of optics, this performance class has never been seen before in stereomicroscopes. Up until now, optical attachments could only achieve a maximum zoom range of 16:1 or a magnification increase without an increase in resolution (empty magnification). Leica Microsystems has made advantageous use of a neurological phenomenon by implementing the new Leica FusionOptic™ (patent applied for): with FusionOptic™, the left beam path produces great depth of field, while the right beam path provides a high-resolution image. The human brain then combines the best information from both channels, using it to compose an image whose resolution and depth of field have never been achieved in any stereomicroscope before.
Top quality surface preparation
Leica Microsystems designed the unique Leica EM TXP as an accurate and time-saving method of preparing high-quality material samples. The new automated precision instrument for preparing cross sections unites four machining technologies in one all-around tool that saws, mills, grinds, and polishes material specimens without the need to transport them between various instruments. This reduces not only the amount of time required, but also the risk of losing specimen detail. All parameters can be preset for each operating step, and the instrument then works fully automatically. With the versatile Leica EM TXP, the user can switch between the individual tools just as easily. High-performance tungsten carbide or diamond cutters, diamond saw blades, and a variety of lapping inserts in combination with the integrated cooling lubrication system enable surface treatment that is optimally matched to specific specimen properties and yield smooth surfaces of the highest quality. And, the optimized stability of the instrument prevents vibration.
Robust and intuitive industrial microscope
Combining state-of-the-art standards in optics with reliable and convenient operation, the Leica DM2500 M is the ideal microscope for the inspection of circuit board cross sections and is affordable for small budgets as well. The rugged system microscope accelerates the work routines in industrial quality control. The color-coded field and aperture diaphragm setting allows intuitive operation.
To match these products, Leica Microsystems is also showing trade fair visitors a well thought-out range of cameras, software solutions and accessories to cover the entire process of quality control in semiconductor fab lines.
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