Sample Preparation is a prerequisite for microscopy. It’s essential for achieving accurate and reproducible results. To get the best results in interfacial characterization, Leica Microsystems developed a triple ion beam cutting technique for electron microscopy observation. This technique is integrated into the ion beam slope cutter Leica EM TIC 3X and optimizes the processing conditions of sample preparation to reveal the nano-sized interfacial features of the specimen.
On May 27, Dr. Gang Ji (http://umet.univ-lille1.fr/detailscomplets.php?id=179), material scientists from Lille University, and Dr. Wolfgang Grünewald, application specialists for solid states sample preparation from Leica Microsystems, Nanotechnology Division, will present their results in artifact-free diamond / Al composite surface for interface characterization without mechanical pre-polishing, using the innovative cutting method by Leica Microsystems.
If you would like to participate and learn more about the cutting method, register onhttp://view6.workcast.net/register?pak=9613387458208801.