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Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.

Rapid Semiconductor Inspection with Microscope Contrast Methods

Semiconductor inspection for QC of materials like wafers can be challenging. Microscope solutions that offer several contrast methods enable fast and reliable defect detection and efficient workflows.

How to Successfully Perform Live-cell CLEM

The Leica Nano workflow provides a streamlined live-cell CLEM solution for getting insight bout structural changes of cellular components over time. Besides the technical handling described in the…

Investigating Synapses in Brain Slices with Enhanced Functional Electron Microscopy

A fundamental question of neuroscience is: what is the relationship between structural and functional properties of synapses? Over the last few decades, electrophysiology has shed light on synaptic…

Fast Visual and Chemical Analysis of Contamination and Underlying Layers

Visual and chemical analysis of contamination on materials with a 2-methods-in-1 solution leading to an efficient, more complete analysis workflow is described in this report. A 2-in-1 solution,…

Microscopy in Virology

The coronavirus SARS-CoV-2, causing the Covid-19 disease effects our world in all aspects. Research to find immunization and treatment methods, in other words to fight this virus, gained highest…

Top Issues Related to Standards for Rating Non-Metallic Inclusions in Steel

Supplying components and products made of steel to users worldwide can require that a single batch be compliant with multiple steel quality standards. This user demand creates significant challenges…

Analyzing Non-metallic Inclusions in Steel

Oftentimes we find ourselves caught up in tedious analyses by reticle and comparison chart, time-consuming double-evaluation according to several standards or subjective inspection results with a bias…

Performing Elemental Analysis down to the Micro Scale

If you work in electronic component analysis, you will be familiar with the many challenges posed. Whether you are identifying metallic particles or checking product authenticity, it’s important to…

Introduction to Ion Beam Etching with the EM TIC 3X

In this article you can learn how to optimize the preparation quality of your samples by using the ion beam etching method with the EM TIC 3X ion beam milling machine. A short introduction of the…