Leica EM TXP
Polissage ionique
Préparation d’échantillons pour MET/MEB
Produits
Accueil
Leica Microsystems
Leica EM TXP Système mécanique de surfaçage et ciblage
Learn more about the Leica EM TXP Target surfacing System
The Leica EM TXP is a unique target preparation device especially developed for cutting, milling, drilling, grinding and polishing samples prior to examination by SEM, TEM and LM techniques.