(benchmark values for this particular sample)
Mechanical pre-preparation with the Leica EM TXP using 9 µm diamond lapping foil at 2600 rpm.
|TIC 3X Parameters|
|Acceleration Voltage||7 kV|
|Gun current||2.6 mA|
- The cross section of the multilayer system looks perfect.
- Even structural details of solder and its interface structure are clearly visible.
- The diffraction pattern of different layers prove the preparation quality.