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Cross Sectioning of a Multilayer System - Preparation of a Perfect Sample Surface for EBSD

Application Note for Leica EM TIC 3X - Industrial Manufacturing

Electron Backscattered Diffraction (EBSD) is a surface technique creating a diffraction pattern (Kikuchi-bands). It can be used for crystal orientation mapping, defect studies, phase identification, grain boundary studies and morphology studies. The information depth is just a few nm.

Therefore good sample preparation is very important to avoid any damage. This is very difficult in case of multilayer system with big differences in hardness.

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Table of Content

Process Description
(benchmark values for this particular sample)
Mechanical pre-preparation with the Leica EM TXP using 9 µm diamond lapping foil at 2600 rpm.

TIC 3X Parameters
Acceleration Voltage7 kV
Gun current2.6 mA
Milling time8h

 

Results

  • The cross section of the multilayer system looks perfect.
  • Even structural details of solder and its interface structure are clearly visible.
  • The diffraction pattern of different layers prove the preparation quality.