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Cross Sectioning of a Superconductive Wire

Application Note for Leica EM TIC 3X - Industrial Manufacturing

Purpose: The shape of the wire is difficult for ion beam slope cutting.

Goal: Cross sectional preparation to see the structure of the wire.

Process Description: (benchmark values for this particular sample)
Mechanical pre-preparation:
1. Embedding in between two Si slices
2. Grinding the cross section with the Leica EM TXP
    (6µm diamond foil) to get a flat surface


Topics & Tags

Table of Content

Ion Milling:

Parameter / Step
Acceleration voltage6 kV
Gun current2 mA
Milling time5 h



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