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Cross Sectioning of a Superconductive Wire

Application Note for Leica EM TIC 3X - Industrial Manufacturing

Purpose: The shape of the wire is difficult for ion beam slope cutting.

Goal: Cross sectional preparation to see the structure of the wire.

Process Description: (benchmark values for this particular sample)
Mechanical pre-preparation:
1. Embedding in between two Si slices
2. Grinding the cross section with the Leica EM TXP
    (6µm diamond foil) to get a flat surface

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Ion Milling:

Parameter / Step
Acceleration voltage6 kV
Gun current2 mA
Milling time5 h

Results:

  • Flat and clean cross section of the superconductive wire
  • Structure of Nb3Sn in the Cu matrix

Fig.1: Cross sectioning - superconductive wire
Fig.2: Cross sectioning - superconductive wire
Fig.3: Cross sectioning - superconductive wire
Fig.4: Cross sectioning - superconductive wire

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Leica EM TIC 3X ‐ Ion Beam Slope Cutter

Leica EM TIC 3X

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Leica EM TXP - Target Preparation Device

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