Cross Sectioning of a Superconductive Wire

Application Note for Leica EM TIC 3X - Industrial Manufacturing

 Wire_Part.jpg

Purpose: The shape of the wire is difficult for ion beam slope cutting.

Goal: Cross sectional preparation to see the structure of the wire.

Process Description: (benchmark values for this particular sample)
Mechanical pre-preparation:
1. Embedding in between two Si slices
2. Grinding the cross section with the Leica EM TXP
    (6µm diamond foil) to get a flat surface

Ion Milling:

Parameter / Step
Acceleration voltage6 kV
Gun current2 mA
Milling time5 h

Results:

  • Flat and clean cross section of the superconductive wire
  • Structure of Nb3Sn in the Cu matrix

Related Articles

Related Pages

Interested to know more?

Talk to our experts. We are happy to answer all your questions and concerns.

Contact Us

Do you prefer personal consulting? Show local contacts

Scroll to top