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Cross Sectioning of Copper for Electron Backscattered Diffraction (EBSD)

Application Note for Leica EM TIC 3X - Material Research

Electron Backscattered Diffraction (EBSD) is a surface technique creating diffraction patterns (Kikuchi-bands). It can be used for crystal orientation mapping, defect studies, phase identification, grain boundary studies and morphological studies. The information depth is just a few nm, therefore good sample preparation is very important to avoid damages.

In this application note we describe how to prepare a perfect sample surface for EBSD.

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Process Description
(benchmark values for this particular sample)
Mechanical pre-preparation: with the Leica EM TXP using a tungsten carbide miller of 15000 rpm.

TIC 3X Parameters
Acceleration voltage7 kV
Gun current2.6 mA
Milling time6 h

  • The prepared surface shows the grain structure of copper.

  • An excellent diffraction pattern proves the preparation quality.

Fig.1: orientation map
Fig.2: band contrast image
Fig.3: SEM image of copper with overlay of the measured area and the corresponding diffraction pattern
Fig.4: Cross section (ion beam slope cut) of copper for EBSD

Related Pages

Related Products

Leica EM TIC 3X ‐ Ion Beam Slope Cutter

Leica EM TIC 3X

Ion Beam Milling System
Leica EM TXP - Target Preparation Device

Leica EM TXP

Target Surfacing System

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