Story

Cross Sectioning of CuSn Connector of a Solar Cell

Application Note for Leica EM TIC 3X - Industrial Manufacturing

Purpose
Ion beam slope cutting is a method that can achieve flat cross sections of soft materials or material combinations consisting of hard and soft components. The CuSn connector is very soft. Mechanical polishing leads to smearing.

Goal
Cross section to see the layer structure and their interfaces.

Process Description
(benchmark values for this particular sample)
Mechanical pre-preparation with Leica EM TXP using 9 µm diamond lapping foil at 2600 rpm.

TIC 3X Parameters
Acceleration voltage7 kV
Gun current2.6 mA
Milling time6 h

Results

  • The cut is very flat and clean
  • The grain structure of CU and Sn is clearly visible. The interface shows an intermediate layer and voids.


Download PDF

Authors

Topics & Tags

Fig.1: Cross section of a Cu/Sn Connector of a solar cell
Fig.2: Cross section of a Cu/Sn Connector of a solar cell
Fig.3: Cross section of a Cu/Sn Connector of a solar cell
Fig.4: Cross section of a Cu/Sn Connector of a solar cell

Related Pages

Related Products

Leica EM TIC 3X ‐ Ion Beam Slope Cutter

Leica EM TIC 3X

Ion Beam Milling System
Leica EM TXP - Target Preparation Device

Leica EM TXP

Target Surfacing System

Interested to know more?

Talk to our experts. We are happy to answer all your questions and concerns.

Contact Us

Do you prefer personal consulting?

  • Leica Microsystems Inc.
    1700 Leider Lane
    Buffalo Grove, IL 60089 United States
    Office Phone : +1 800 248 0123
    Service Phone : 1 800 248 0223
    Fax : +1 847-236-3009
    Routeplanner (google maps)

You will find a more detailed list of local contacts here.