Story

Cross Sectioning of Ni/Cu on Steel for EBSD

Application Note for Leica EM TIC 3X - Material Research

Purpose
Electron Backscattered Diffraction (EBSD) is a surface technique creating a diffraction pattern (Kikuchi-bands). It can be used for crystal orientation mapping, defect studies, phase identification, grain boundary studies and morphology studies. The information depth is just a few nm. Therefore a good sample preparation is very important.

Goal
Preparation of a perfect sample surface for EBSD.

Authors

Topics & Tags

Process Description
(benchmark values for this particular sample)
Mechanical pre-preparation with the Leica EM TXP using 9 µm diamond lapping foil at 2600 rpm.

TIC 3X Parameters
Acceleration voltage7 kV
Gun current2.6 mA
Milling time6 h


Results

  • The surface quality is very good.
  • Steel has areas with big grains.
  • The diffraction pattern prooves the preparation quality.

Fig.1: Cross Section of Ni/Cu Son
Fig.2: SEM image with corresponding diffraction patterns
Fig.3: Orientation map
Fig.4: Band contrast image

Download PDF

Related Articles

Related Pages

Related Products

Leica EM TIC 3X ‐ Ion Beam Slope Cutter

Leica EM TIC 3X

Ion Beam Milling System
Leica EM TXP - Target Preparation Device

Leica EM TXP

Target Surfacing System

Interested to know more?

Talk to our experts. We are happy to answer all your questions and concerns.

Contact Us

Do you prefer personal consulting?

  • Leica Microsystems Inc.
    1700 Leider Lane
    Buffalo Grove, IL 60089 United States
    Office Phone : +1 800 248 0123
    Service Phone : 1 800 248 0223
    Fax : +1 847-236-3009
    Routeplanner (google maps)

You will find a more detailed list of local contacts here.