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Image Gallery: Digital Microscopy Used in Microelectronics and Electronics Quality Control

Quality Control in the electronics and microelectronics industry is confronted with many challenges: A variety of different materials in a sample, some of them metallic and reflective, some matt; a variety of material layers and heights, most often very intricate and hard to discern. Users in microelectronics quality control seek to identify deviations from the standard and improve the production processes so that defects are minimized or even eliminated.

This affects production directly: Samples that exceed tolerances either need to be reworked, or are scrapped directly. The ultimate goal is the continuous improvement of reliability, performance, and efficiency of the device Digital microscopes play an important role in inspection and quality control workflows. This image gallery shows typical (micro)electronic samples imaged with the Leica DVM6 digital microscope using different functions like zooming, tilting, tiling, multifocus imaging, different illuminations and contrasting methods, and 3D measurement.

Download your free whitepaper on: Fast and Reliable Inspection of Printed Circuit Boards with Digital Microscopy.

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Full overview of a sensor chip with low objective and ring light illumination
Full overview of a sensor chip with low objective and ring light illumination
Zoom-in on a sensor chip with middle objective and ring light illumination
Zoom-in on a sensor chip with middle objective and ring light illumination
Zoom-in on a sensor chip with low objective and ring light illumination
Zoom-in on a sensor chip with low objective and ring light illumination
Zoom-in on a sensor chip with middle objective and ring light illumination
Zoom-in on a sensor chip with middle objective and ring light illumination
Zoom-in on a sensor chip, 750x
Zoom-in on a sensor chip, 750x
Low magnification overview image of a PCB part
Low magnification overview image of a PCB part
LAS X screenshot of a PCB with 5° tilt at 20° stage rotation-encoding displayed in operation panel
LAS X screenshot of a PCB with 5° tilt at 20° stage rotation-encoding displayed in operation panel
LAS X screenshot of a 3D measurement of a capacitor on a PCB
LAS X screenshot of a 3D measurement of a capacitor on a PCB
Zoom-in on the soldered ends of a resistor with ring light illumination
Zoom-in on the soldered ends of a resistor with ring light illumination
Zoom-in on the soldered ends of a resistor with ring light illumination and a diffusor to reduce glare
Zoom-in on the soldered ends of a resistor with ring light illumination and a diffusor to reduce glare
LAS X screenshot showing a 3D typography and measurements in the height profile
LAS X screenshot showing a 3D typography and measurements in the height profile
Tile scan of a PCB part with extended depth of field (EDOF) function in LAS X
Tile scan of a PCB part with extended depth of field (EDOF) function in LAS X
Image of a PCB with high-dynamic range (HDR), sample inspection at 30° stage rotation
Image of a PCB with high-dynamic range (HDR), sample inspection at 30° stage rotation
Through hole vias in a PCB inspected with 14° tilt and ring light
Through hole vias in a PCB inspected with 14° tilt and ring light
Through hole vias in a PCB inspected with 14° tilt, ring light illumination and backlight adapter
Through hole vias in a PCB inspected with 14° tilt, ring light illumination and backlight adapter
Solderings in a PCB captured with 31° tilt at 43° stage rotation
Solderings in a PCB captured with 31° tilt at 43° stage rotation
Miniature HF-connector for Wi-Fi antennas used in microelectronic devices
Miniature HF-connector for Wi-Fi antennas used in microelectronic devices
Multifocus image of a blind microvia in a PCB, recorded at mag. 650x
Multifocus image of a blind microvia in a PCB, recorded at mag. 650x
Overview image of microvias in a PCB
Overview image of microvias in a PCB
Zoom-in on scratches in a multi-layer-PCB
Zoom-in on scratches in a multi-layer-PCB
Part of a wafer captured with open coax, mag. 750x
Part of a wafer captured with open coax, mag. 750x
Part of a wafer captured with open coax and relief contrast, mag. 750x
Part of a wafer captured with open coax and relief contrast, mag. 750x
Part of a wafer captured with open coax and enhanced relief contrast, mag. 750x
Part of a wafer captured with open coax and enhanced relief contrast, mag. 750x
Part of a wafer captured with ringlight illumination, mag. 750x
Part of a wafer captured with ringlight illumination, mag. 750x
Au-plated Bondpad,  Automotive electronics, mag. 120x
Au-plated Bondpad, Automotive electronics, mag. 120x
Zoom-in on Au-plated Bondpad, Automotive electronics, mag. 360x
Zoom-in on Au-plated Bondpad, Automotive electronics, mag. 360x
Low magnification image of a leadframe, mag. 13x
Low magnification image of a leadframe, mag. 13x
Four views on the cross sections of a Sn-plated copper leadframe with different contrasting options
Four views on the cross sections of a Sn-plated copper leadframe with different contrasting options
Image of a membrane switch, mag. 60x
Image of a membrane switch, mag. 60x
Image of a press fit contact pin of a PCB
Image of a press fit contact pin of a PCB
Zoom-in on the tip of a press fit contact pin of a PCB
Zoom-in on the tip of a press fit contact pin of a PCB
3D measurements on the tip of press fit contact pin with LAS X
3D measurements on the tip of press fit contact pin with LAS X