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Science Lab

Science Lab

Science Lab

The knowledge portal of Leica Microsystems offers scientific research and teaching material on the subjects of microscopy. The content is designed to support beginners, experienced practitioners and scientists alike in their everyday work and experiments. Explore interactive tutorials and application notes, discover the basics of microscopy as well as high-end technologies – become part of the Science Lab community and share your expertise!
Image of burrs (red arrows) at the edge of a battery electrode acquired with a DVM6 digital microscope.

Burr Detection During Battery Manufacturing

See how optical microscopy can be used for burr detection on battery electrodes and determination of damage potential to achieve rapid and reliable quality control during battery manufacturing.
Particles observed on the surface of a particle trap which could be used for technical cleanliness during battery production.

Battery Particle Detection During the Production Process

How battery particle detection and analysis is enhanced with optical microscopy and laser spectroscopy for rapid, reliable, and cost-effective QC during battery production is explained in this…
Particulate contamination in between moving metal plates.

Key Factors for Efficient Cleanliness Analysis

An overview of the key factors necessary for technical cleanliness and efficient cleanliness analysis concerning automotive and electronics manufacturing and production is provided in this article.
Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.

Rapid Semiconductor Inspection with Microscope Contrast Methods

Semiconductor inspection for QC of materials like wafers can be challenging. Microscope solutions that offer several contrast methods enable fast and reliable defect detection and efficient workflows.
Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.

Cross-section Analysis for Electronics Manufacturing

This article describes cross-section analysis for electronics concerning quality control and failure analysis of printed circuit boards (PCBs) and assemblies (PCBAs), integrated circuits (ICs), etc.
Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.

Structural and Chemical Analysis of IC-Chip Cross Sections

This article shows how electronic IC-chip cross sections can be efficiently and reliably prepared and then analyzed, both visually and chemically at the microscale, with the EM TXP and DM6 M LIBS…
Stereo microscopes are often considered the workhorses of laboratories and production sites.

Key Factors to Consider When Selecting a Stereo Microscope

This article explains key factors that help users determine which stereo microscope solution can best meet their needs, depending on the application.

Rapid and Reliable Examination of PCBs & PCBAs with Digital Microscopy

Digital microscopes provide users with a convenient and rapid way to acquire high-quality, reliable image data and make quick inspection and analysis of printed circuit boards (PCBs) and assemblies…
The principle of the FusionOptics technology: Of the two separate beam paths (1), one provides depth of field (2) and the other high resolution (3). In the brain, the two images of the sample are merged into a single, optimal 3D image (4).

What is the FusionOptics Technology?

Leica stereo microscopes with FusionOptics provide optimal 3D perception. The brain merges two images, one with large depth of field and the other with high resolution, into one 3D image.
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