Mechanical pre-preparation: The mechanical pre-preparation took place using the methods described in this chapter using a Ti grid. Double sided polishing of the sample was carried out with the Leica EM TXP Target Surfacing System: Diamond foils: 15 µm, 9 µm, 6 µm, 3 µm, 1 µm and 0.5 µm at 2200 rpm until the final sample thickness of 30 µm.
|Acceleration voltage:||7 kV / 2 kV (final thinning)|
|Milling angle:||5° (milling on both sides)|
|Sample movement:||Oscillation (45°)|
The structures of interest lie within the radiated area of the sample. The structures were very evenly thinned, so that even high resolution TEM examination of the interfaces were possible.