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  • Characterization of Thin Films Using High Definition Confocal Microscopy

    Thin film characterization technologies are in high demand, given the wide-spread use of coatings in all engineering and science fields. The properties of thin films can vary dramatically, i.e. thickness, optical and electrical properties, hardness, etc., that is difficult to find a general purpose characterization technique.
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  • Automated Digital 3D Topography Measurement with the Leica DCM 3D Dual Core Measuring Microscope

    The precise measurement of surface structures and topography is the key thing during the production, control and development in many sectors of industry or research. Because very often there is not possible to use some contact methods for performing this task new optical methods based on interferometry and confocal technology started to be available for non-contact surface metrology in the recent years.
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  • No Defect Goes Undetected - Inspection of Micro-optic Components

    Micro-optic components are used in a host of products concerned with illumination or imaging. Quality control of these components is challenging, as inspection has to be highly accurate yet non-invasive. Combining confocal and interferometric technology, the Leica DCM 3D Measuring Microscope is equipped to characterize these components with nanometer precision and ultra fast speed, despite the fact that they often have polished and curved surfaces that are difficult to examine.
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  • 3D Measuring Microscope Combines Confocal and Interferometry Techniques

    In recent years, interferometers and optical imaging profilers based on confocal technology have been competing fiercely to conquer the non-contact surface metrology market. They are both capable of accurately and reliably measuring surface topographies on a millimeter to nanometer scale. Leica Microsystems presents a complete solution which combines both confocal and interferometry techniques: the Leica DCM 3D Dual-Core 3D Measuring Microscope.
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