Leica Science Lab - Tag : Printed Circuit Board https://www.leica-microsystems.com//science-lab/tag/tags/printed-circuit-board/show/Tag/ Article tagged with Printed Circuit Board en-US https://www.leica-microsystems.com/25016 Quality Assurance Metallography Fast Visual and Chemical Analysis of Contamination and Underlying Layers Visual and chemical analysis of contamination on materials with a 2-methods-in-1 solution leading to an efficient, more complete analysis workflow is described in this report. A 2-in-1 solution, combining optical microscopy and laser induced breakdown spectroscopy (LIBS), in addition to simultaneous visual and chemical inspection, can be used to quickly remove contamination and inspect the underlying base material. For inspection of components or parts, such as soldering and leads on printed circuit boards (electronics) or metal panels on vehicles (automotive and transport), understanding the effects of contamination are important. https://www.leica-microsystems.com//science-lab/fast-visual-and-chemical-analysis-of-contamination-and-underlying-layers/ Wed, 22 May 2019 22:00:00 +0000 PhD James DeRose, Mike Horz, Dr. Kay Scheffler https://www.leica-microsystems.com/24965 Digital Microscopy Stereo Microscopy Quality Assurance How to create EDOF (Extended Depth of Focus) images Watch this video to see how you can rapidly record sharp optical microscope images of samples with a large height variation. This is done with the optional Extended Depth of Focus (EDOF) function of the LAS X software from Leica Microsystems. Acquisition of EDOF images of a printed circuit board, recorded from low to high magnification using a Leica microscope, are shown as an example. The operation of EDOF by acquiring a z-stack of images in 3 modes is demonstrated. https://www.leica-microsystems.com//science-lab/how-to-create-edof-extended-depth-of-focus-images/ Wed, 08 May 2019 22:00:00 +0000 Clinton Smith, Mike Horz https://www.leica-microsystems.com/19763 Metallography Quality Assurance Forensics See the Structure with Microscopy - Know the Composition with Laser Spectroscopy The advantages of a 2-in-1 materials analysis solution combining optical microscopy and laser induced breakdown spectroscopy (LIBS) for simultaneous visual and chemical inspection are described in this report. The basic principles of the 2-in-1 solution and a comparison between it and other common materials analysis methods, such scanning electron microscopy (SEM), are explained to demonstrate how a rapid, efficient workflow is achieved. A 2-in-1 analysis solution can reduce significantly the cost and time for obtaining material image and composition data. Such data are instrumental in assuring quality and reliability to make confident decisions quickly during production, quality control, failure analysis, and research and development in industries and fields, such as automotive and metallurgy. https://www.leica-microsystems.com//science-lab/see-the-structure-with-microscopy-know-the-composition-with-laser-spectroscopy/ Mon, 11 Jun 2018 13:39:00 +0000 PhD James DeRose, Dr. Kay Scheffler https://www.leica-microsystems.com/20117 Metallography Leica is MAD about LIBS When analyzing material for cleanliness testing, users normally just want a simple way to know whether the particle under scrutiny is normal debris or something more risky. Users can now “LIBS” it to acquire rapidly the composition and then move onto the next manufacturing step. https://www.leica-microsystems.com//science-lab/leica-is-mad-about-libs/ Sun, 22 Apr 2018 22:00:00 +0000 Mike Tjepkema, PhD James DeRose https://www.leica-microsystems.com/17943 Quality Assurance Digital Microscopy Fast and Reliable Inspection of Printed Circuit Boards with Digital Microscopy Digital microscopy has been used more and more for inspection, quality control and assurance (QC/QA), failure analysis (FA), and research and development (R&D) in the microelectronics industry, especially for printed circuit boards (PCBs). Digital microscopes are practical to use and allow an efficient workflow for inspection. https://www.leica-microsystems.com//science-lab/fast-and-reliable-inspection-of-printed-circuit-boards-with-digital-microscopy/ Mon, 23 May 2016 12:26:00 +0000 PhD James DeRose, Giancarlo Parma https://www.leica-microsystems.com/17945 Digital Microscopy Quality Assurance Image Gallery: Digital Microscopy Used in Microelectronics and Electronics Quality Control Quality Control in the electronics and microelectronics industry is confronted with many challenges: A variety of different materials in a sample, some of them metallic and reflective, some matt; a variety of material layers and heights, most often very intricate and hard to discern. Users in microelectronics quality control seek to identify deviations from the standard and improve the production processes so that defects are minimized or even eliminated. https://www.leica-microsystems.com//science-lab/galleries/image-gallery-digital-microscopy-used-in-microelectronics-and-electronics-quality-control/ Thu, 19 May 2016 11:23:00 +0000 PhD James DeRose, Claudia Müller https://www.leica-microsystems.com/17398 Quality Assurance Digital Microscopy Inspecting and Analyzing Printed Circuit Boards Quickly and Reliably with a Digital Microscope For the past several years, digital microscopy has been shown to be useful for inspection, quality control and assurance (QC/QA), and failure analysis (FA) in the microelectronics industry, especially for printed circuit boards (PCBs). Recently, state-of-the-art improvements have made digital microscopy even more powerful and practical for inspection, leading to a more efficient workflow. Here, the advantages of certain digital microscope features, i.e., intuitive software for operation and analysis, fast and easy ways to change magnification, and encoding for reliable recall of parameters, are explained. https://www.leica-microsystems.com//science-lab/inspecting-and-analyzing-printed-circuit-boards-quickly-and-reliably-with-a-digital-microscope/ Mon, 11 Jan 2016 09:09:00 +0000 PhD James DeRose, Georg Schlaffer