Leica Science Lab - Tag : Semiconductor https://www.leica-microsystems.com//science-lab/tag/tags/semiconductor/show/Tag/ Article tagged with Semiconductor en-US https://www.leica-microsystems.com/24967 Digital Microscopy Surface Metrology Quality Assurance Automated topographic analysis with the Leica Map software Watch this video to learn how you can save time when doing topographic analysis using the Leica Map software. The software allows you to go quickly from automated analysis of multiple sets of acquired topographic data to the reporting of precise results. https://www.leica-microsystems.com//science-lab/for-rapid-accurate-reporting-of-results/ Wed, 08 May 2019 22:00:00 +0000 M.S. Albert S. Laforet, PhD James DeRose https://www.leica-microsystems.com/19544 Stereo Microscopy Digital Microscopy Coming to Grips with Biological Information Through Flexible Organic Electronics: Developing Bendable and Stretchable Biosensors and Device What do you associate with the word sensor? Perhaps technologies delivering automation in factories and other production sites? That may be what comes to mind, but advances in organic electronics are now driving the rapid development of biological sensors that measure physiological signals when in contact with the skin, organs, and other parts of the body. https://www.leica-microsystems.com//science-lab/coming-to-grips-with-biological-information-through-flexible-organic-electronics-developing-bendable-and-stretchable-biosensors-and-device/ Wed, 28 Jun 2017 10:14:00 +0000 Kuniko Yagura, PhD James DeRose https://www.leica-microsystems.com/15854 Digital Microscopy Quality Assurance Surface Metrology Digital Microscopy with Versatile Illumination and Various Contrast Methods for More Efficient Inspection and Quality Control State-of-the-art digital microscopes utilizing a versatile illumination system capable of achieving multiple contrast methods, such as the Leica DVM6, are very useful for inspection, quality control, and failure analysis. These contrast methods allow flaws or defects on the surface of a product or component to be more easily and rapidly detected. https://www.leica-microsystems.com//science-lab/digital-microscopy-with-versatile-illumination-and-various-contrast-methods-for-more-efficient-inspection-and-quality-control/ Mon, 16 Jan 2017 10:53:00 +0000 PhD James DeRose, Georg Schlaffer https://www.leica-microsystems.com/18225 EM Sample Preparation In-Containing Compound Semiconductors - Sample Preparation for TEM Application Note for Leica EM RES102 - Previous studies showed that surface accumulation of In occurs when InP was milled in a conventional way with Ar ions. The consequence is In islands on the sample surface. This leads to low quality of TEM samples. To remove these islands, reactive ion milling with iodine ions (RIBE / CAIBE) can be used. This method has the disadvantage of polluting the ion guns and the vacuum system of the ion milling device and leads to chemical reactions with the sample material. To avoid these problems we prepared these samples very gently with low energy Ar ions. https://www.leica-microsystems.com//science-lab/in-containing-compound-semiconductors-sample-preparation-for-tem/ Mon, 12 Dec 2016 10:13:00 +0000 PhD Wolfgang Grünewald https://www.leica-microsystems.com/18255 EM Sample Preparation "Shallow Trench Isolation" Structures - Sample Preparation for TEM Application Note for Leica EM RES102 - The cross-sectional preparation of structured semiconductor materials requires a very thorough mechanical pre-preparation. In doing this, it must be ensured that the structure of interest should be located as close to the centre of the sample as possible. As the sample will be ion milled from both sides, a specific preparation of the structure is necessary in most cases, which means that you must thin these structures from both sides. https://www.leica-microsystems.com//science-lab/shallow-trench-isolation-structures-sample-preparation-for-tem/ Fri, 18 Nov 2016 16:50:00 +0000 PhD Wolfgang Grünewald https://www.leica-microsystems.com/18213 EM Sample Preparation Cross-Sectional Preparation of Structured Semiconductor Materials for TEM Application Note for Leica EM RES102 - The vertical layer construction of a semiconductor structure should be examined as a TEM cross-sectional sample. In addition to the specific preparation of the desired structure, the widely different sputter rates and atomic weights of the individual components represent the level of difficulty involved with this preparation problem. https://www.leica-microsystems.com//science-lab/cross-sectional-preparation-of-structured-semiconductor-materials-for-tem/ Mon, 31 Oct 2016 08:15:00 +0000 PhD Wolfgang Grünewald https://www.leica-microsystems.com/18235 EM Sample Preparation Contrast Enhancement of Polished Cross Sections of Semiconductor Structures - Sample Preparation for SEM Application Note for Leica EM RES102 - The surfaces of polished cross sections often show fine scratches and residues of the removed material or of the abrasive material. The artefacts are strongly material-dependent, and are mostly only detectable at higher resolutions in the scanning electron microscope. A further problem arises from the fact that the ground section mostly only has low contrast, i.e., in the structures of the semiconductor materials are very difficult to discern. With the use of ion beam milling, the ground sections of semiconductor structures can be "contrasted". https://www.leica-microsystems.com//science-lab/contrast-enhancement-of-polished-cross-sections-of-semiconductor-structures-sample-preparation-for-sem/ Fri, 28 Oct 2016 12:08:00 +0000 PhD Wolfgang Grünewald https://www.leica-microsystems.com/17945 Digital Microscopy Quality Assurance Image Gallery: Digital Microscopy Used in Microelectronics and Electronics Quality Control Quality Control in the electronics and microelectronics industry is confronted with many challenges: A variety of different materials in a sample, some of them metallic and reflective, some matt; a variety of material layers and heights, most often very intricate and hard to discern. Users in microelectronics quality control seek to identify deviations from the standard and improve the production processes so that defects are minimized or even eliminated. https://www.leica-microsystems.com//science-lab/galleries/image-gallery-digital-microscopy-used-in-microelectronics-and-electronics-quality-control/ Thu, 19 May 2016 11:23:00 +0000 PhD James DeRose, Claudia Müller https://www.leica-microsystems.com/17398 Quality Assurance Digital Microscopy Inspecting and Analyzing Printed Circuit Boards Quickly and Reliably with a Digital Microscope For the past several years, digital microscopy has been shown to be useful for inspection, quality control and assurance (QC/QA), and failure analysis (FA) in the microelectronics industry, especially for printed circuit boards (PCBs). Recently, state-of-the-art improvements have made digital microscopy even more powerful and practical for inspection, leading to a more efficient workflow. Here, the advantages of certain digital microscope features, i.e., intuitive software for operation and analysis, fast and easy ways to change magnification, and encoding for reliable recall of parameters, are explained. https://www.leica-microsystems.com//science-lab/inspecting-and-analyzing-printed-circuit-boards-quickly-and-reliably-with-a-digital-microscope/ Mon, 11 Jan 2016 09:09:00 +0000 PhD James DeRose, Georg Schlaffer https://www.leica-microsystems.com/17358 EM Sample Preparation TEM Sample Preparation Made Easy - Prepare TEM Specimen by Broad Beam Argon Ion Milling Quantitative and analytical analysis at high spatial resolution places stringent demands on the quality of the produced TEM specimens. Pristine and high-quality samples are indispensible for atomic resolution TEM analysis. In this application note a general procedure for obtaining cross-sectional and plan-view TEM specimens using the Leica EM RES102 ion milling system is outlined. The procedure described below can be easily adapted for a large range of materials e.g. thin film materials, semiconductors, multilayered materials, ceramics, superconductors, … https://www.leica-microsystems.com//science-lab/tem-sample-preparation-made-easy-prepare-tem-specimen-by-broad-beam-argon-ion-milling/ Tue, 15 Dec 2015 12:03:00 +0000 PhD Frédéric Leroux https://www.leica-microsystems.com/16804 EM Sample Preparation Electron Microscopy Sample Preparation: “The Future is Cold, Dynamic and Hybrid” In 2014, the renowned Electron Microscopy for Materials Science (EMAT) research lab at the University Antwerp, Belgium, and Leica Microsystems started a fruitful collaboration to establish a Leica Reference Site in Antwerp. This site, officially opened in July 2014, is dedicated to specimen preparation for electron microscopy in materials science with a special focus on ion beam milling and recently also on carbon coating. In this interview Prof Gustaf van Tendeloo, Director of EMAT, and Frédéric Leroux, TEM specimen preparation specialist, talk about research topics at EMAT, how the Leica reference site has evolved, and future trends for EM sample preparation. https://www.leica-microsystems.com//science-lab/electron-microscopy-sample-preparation-the-future-is-cold-dynamic-and-hybrid/ Thu, 22 Oct 2015 19:22:00 +0000 Prof. Gustaaf (Staf) Van Tendeloo, PhD Frédéric Leroux, Florence Hauger https://www.leica-microsystems.com/6828 Digital Microscopy Quality Assurance Digital Microscopy Digital microscopy offers clear advantages for a large number of industrial quality inspections, particularly for surface analysis. Here, you can find some videos that show examples of application for digital microscopy. https://www.leica-microsystems.com//science-lab/digital-microscopy/ Tue, 16 Oct 2012 22:00:00 +0000 Georg Schlaffer https://www.leica-microsystems.com/8076 Surface Metrology Digital Microscopy Quality Assurance 3D Surface Measurement: Characterization of Solar Cells Solar energy is becoming more and more important all around the globe. Not only is it available in unlimited supply, it also offers key advantages for protecting the climate and the environment. Every year, many thousands of solar cells are produced worldwide for new photovoltaic plants. An important criterion for quality control is 3D characterization of the light-absorbing surface. In the past, this required time-consuming SEM analysis. A Dual-Core 3D Measuring Microscope that combines confocal and interferometry technology offers non-contact, high-precision analysis of the surface texture of solar cells in a matter of seconds. https://www.leica-microsystems.com//science-lab/3d-surface-measurement-characterization-of-solar-cells/ Mon, 27 Apr 2009 22:00:00 +0000 Roger Artigas