Ion Beam Milling System Leica EM TIC 3X
Triple‑beam ion milling for pristine, large‑area cross‑sections
Create high‑quality milling surfaces using three broad argon ion beams to reveal true microstructure and maximize analysis yield.
- Uniform milling with reduced curtaining over large areas
- High material removal rates for fast preparation
- Simplified setup—triple broad‑beam milling with no stage rotation
Why EM TIC 3X
High‑quality preparation results, fewer artifacts
Produce pristine, artifact‑reduced surfaces across hard, soft, brittle, or heterogeneous materials—ideal for SEM, EBSD, and advanced microstructural analyses.
High throughput for busy labs
Accelerate sample preparation with a workflow adapted to high‑throughput labs, including multiple‑sample stage options and a streamlined path from pre‑preparation to ion milling.
Shorter lead‑times with EM TXP
Maintain consistent sample orientation and support by using the same holder across EM TXP and EM TIC 3X, cutting handling steps and saving time.
Protect sensitive samples with EM VCT500 transfer shuttle
Transfer under cryogenic or vacuum conditions to minimize contamination and ice formation—keeping sensitive samples protected up to coating and (cryo)‑SEM.
What you can achieve
Batteries & energy storage
Clean cross‑sections of separators and electrodes with minimal redeposition or delamination for high‑resolution SEM analysis and QC/FA.
Electronics: PCBs, ICs & assemblies
Reliable cross‑sections for structural and chemical analysis—streamlined from pre‑cutting to final ion milling.
EBSD & materials science
Uniform, high‑quality surfaces EBSD demands—even on mixed crystallographic materials.
The Triple Ion Beam Milling System - How it works (workflow synergy)
- Target the area of interest with EM TXP for efficient pre-preparation.
- Mill with EM TIC 3X: three broad ion beams create large, uniform cross‑sections and high‑quality finish—no stage rotation required.
- Transfer with EM VCT500 under cryo/vacuum to preserve sample integrity up to coating and analysis.
Technical highlights
- Triple ion beam system for uniform milling and reduced curtaining – no stage rotation.
- Large area & fast removal: cross sections > 4 × 1 mm; uniform flat‑milled areas up to Ø 25 mm).
- Flexible setup: exchangeable stages (standard, multiple sample, rotary, cooling) and intuitive UI for fast, precise alignment.
- Flexible setup: exchangeable stages (standard, multiple sample, rotary, cooling) and intuitive UI for fast, precise alignment.
For research use only.
Frequently asked questions
What is ion beam milling and why choose triple‑beam?
High‑energy argon ions remove material to produce ultra‑smooth, artifact‑reduced surfaces. EM TIC 3X’s triple‑beam design yields uniform, high‑quality surfaces over large areas—without stage rotation.
Which materials can I process?
Metals, ceramics, polymers, composites, and more—including soft, porous, brittle, or heat‑sensitive samples.
Can I work with cryo or atmosphere‑sensitive samples?
Yes. With cooling and EM VCT500 transfer, you can maintain cryogenic temperatures or vacuum/protected atmosphere through preparation to analysis.
