Ion Beam Milling System Leica EM TIC 3X
Efficiency & Flexibility.
The updated version of the EM TIC 3X is based on our motto ‘with the user for the user’ in combining performance and flexibility in a practically-relevant way. The doubled ion milling rate of the latest EM TIC 3X can be further enhanced with the option of five different stages adapted to your application requirements.
The Triple Ion Beam Milling System
Leica EM TIC 3X allows production of scratch-free cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) as well as AFM investigations. With the Leica EM TIC 3X you can achieve high quality surfaces of almost any material at room temperature or cryo conditions, revealing the internal structures of the sample in a near native state. We at Leica offer products and workflows for sample preparation that lead to excellent results. We would like to convince you, not only with words, but also with results, of the benefits of doing sample preparation with Leica instruments. Contact us today for a free-of-charge demo of your own sample. We also provide a step-by-step protocol with detailed information that you can use when running the ion milling machine yourself.
