Leica EM UC7
초박절편(Ultramicrotomes) & 초저온(Cryo) 초박 절편
전자현미경 시료 전처리
제품소개
홈
Leica Microsystems
Leica EM UC7 상온 및 저온 절편을 위한 Ultramicrotome
Cross Section, Aluminum with OxidLayer
non embedded, sectioned with DIATOME diamond knife at room temperature, TEM image
Cross Section, Copper and Gold Layers
non embedded, sectioned with DIATOME diamond knife at room temperature, TEM image
Cross Section, Bismuth Telluride on glass substrate
embedded, sectioned with DIATOME diamond knife at room temperature
Cross Section, Si Wafer
embedded, sectioned with DIATOME diamond knife at room temperature, TEM image
Section, High Impact Polystyrene
OsO4stained, sectioned with DIATOME diamond knife at room temperature, HAADF, TEM image
Cross Section Surface, Razor Blade
non embedded, sectioned with DIATOME diamond knife at room temperature, SEM image
Cross Section Surface, Pre Paid Card
Ru04stained, sectioned with diamond knife at room temperture, treated with a special plasma etching device, SEM image