연락처
연락처

Leica EM UC7 상온 및 저온 절편을 위한 Ultramicrotome

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Cross Section, Aluminum with OxidLayer

non embedded, sectioned with DIATOME diamond knife at room temperature, TEM image

Cross Section, Copper and Gold Layers

non embedded, sectioned with DIATOME diamond knife at room temperature, TEM image

Cross Section, Bismuth Telluride on glass substrate

embedded, sectioned with DIATOME diamond knife at room temperature

Cross Section, Si Wafer

embedded, sectioned with DIATOME diamond knife at room temperature, TEM image

Sodium Chloride

non embedded, dry sectioned with DIATOME diamond knife at room temperature

Gallium Arsenide

embedded, sectioned wth DIATOME diamond knife at room temperature

Section, Toner Powder

embedded, sectioned with DIATOME diamond knife at room temperature, TEM image

Section, Rubber Particles

sectioned with DIATOME diamond knife at low temperature, TEM image

Section ABS

OsO4stained, sectioned with DIATOME diamond knife at room temperature, HAADF, TEM image

Section, High Impact Polystyrene

OsO4stained, sectioned with DIATOME diamond knife at room temperature, HAADF, TEM image

Cross Section Surface, Razor Blade

non embedded, sectioned with DIATOME diamond knife at room temperature, SEM image

Cross Section Surface, Pre Paid Card

Ru04stained, sectioned with diamond knife at room temperture, treated with a special plasma etching device, SEM image

Ultramicrotomy sectioning of Al

Sectioning of Aluminium with Ultramicrotome Leica EM UC7

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