연락처
연락처

Leica DM12000 M 12인치 정밀 검사&분석 시스템

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Image of burrs (red arrows) at the edge of a battery electrode acquired with a DVM6 digital microscope.

Burr Detection During Battery Manufacturing

See how optical microscopy can be used for burr detection on battery electrodes and determination of damage potential to achieve rapid and reliable quality control during battery manufacturing.
Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.

Rapid Semiconductor Inspection with Microscope Contrast Methods

Semiconductor inspection for QC of materials like wafers can be challenging. Microscope solutions that offer several contrast methods enable fast and reliable defect detection and efficient workflows.
Wafer

How to Boost your Microelectronic Component Inspection Performance

Do you need to see more when inspecting silicon wafers or MEMS? Would you like to get sharp and detailed sample images which are similar to those from electron microscopes? Watch this free webinar…

Brief Introduction to Surface Metrology

This report briefly discusses several important metrology techniques and standard definitions commonly used to assess the topography of surfaces, also known as surface texture or surface finish. With…

적용 분야

반도체 웨이퍼 처리, IC 패키징, IC 어셈블리 및 테스트

Leica Microsystems’ customized, modular imaging solutions help suppliers and device manufacturers achieve fast and precise inspection and analysis for wafer processing, IC packaging, IC assembly, and…

산업용 현미경 시장

가동 시간을 최대화하고 목표를 달성하면 수익에 효율적으로 도움이 됩니다. Leica 현미경 솔루션은 가장 작은 샘플 세부 사항에 대한 통찰력을 제공할 뿐만 아니라 결과를 빠르고 안정적으로 분석, 문서화 및 보고할 수 있습니다. Leica Microsystems는 다양한 애플리케이션 요구 사항을 충족하는 데 도움이 되는 광범위한 솔루션과 전문가 지원을…
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