Leica EM TIC 3X 이온 빔 밀링 시스템

Efficiency and flexibility

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Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.

Cross-section Analysis for Electronics Manufacturing

Cross-section analysis for electronics concerning quality control and failure analysis of printed circuit boards (PCBs) and assemblies (PCBAs), integrated circuits (ICs), etc. are described in this…
Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.

Structural and Chemical Analysis of IC-Chip Cross Sections

This article shows how electronic IC-chip cross sections can be efficiently and reliably prepared and then analyzed, both visually and chemically at the microscale, with the EM TXP and DM6 M LIBS…
EBSD grain size distribution of the cross section of a gold wire within a silicon matrix from inside a CPU (central processing unit of a computer). The grains are highlighted with arbitrary colors.

High-Quality EBSD Sample Preparation

This article describes a method for EBSD sample preparation of challenging materials. The high-quality samples required for electron backscatter diffraction are prepared with broad ion-beam milling.
SEM image of the full Li-NMC electrode sample, showing the two porous layers and the metal film at the center of the structure.

Cross Section Ion Beam Milling of Battery Components

Sample Preparation of Lithium battery systems requires high quality surface preparation to evaluate their internal structure and morphology. Due to the brittle materials involved, preparing pristine…
3D reconstruction of an intercellular bridge in a C. elegans embryo

Download EM Workflow Solutions Booklet

This publication is a compilation of appropriate workflows for the most frequently used sample preparation methods, like Correlative Methodologies, Optogenetics & Electro-Physiology, Surface Analysis,…

Exploring the Structure and Life Cycle of Viruses

The SARS-CoV-2 outbreak started in late December 2019 and has since reached a global pandemic, leading to a worldwide battle against COVID-19. The ever-evolving electron microscopy methods offer a…
Product image EM TIC 3X

Application Booklet for EM TIC 3X

Today, ion beam milling is one of the most widely-used methods for preparing samples for electron microscopy. Download this 76-pages booklet today and learn how to improve your processes.

Workflows and Instrumentation for Cryo-electron Microscopy

Cryo-electron microscopy is an increasingly popular modality to study the structures of macromolecular complexes and has enabled numerous new insights in cell biology. In recent years, cryo-electron…

Introduction to Ion Beam Etching with the EM TIC 3X

In this article you can learn how to optimize the preparation quality of your samples by using the ion beam etching method with the EM TIC 3X ion beam milling machine. A short introduction of the…

Workflow Solutions for Sample Preparation Methods for Material Science

This brochure presents and explains appropriate workflow solutions for the most frequently required sample preparation methods for material science samples.

Studying the Microstructure of Natural Polymers in Fine Detail

The potential of cryogenic broad ion beam milling used in combination with scanning electron microscopy (cryo-BIB-SEM) for imaging and analyzing the microstructure of cryogenically stabilized soft…

Macroscale to Nanoscale Pore Analysis of Shale and Carbonate Rocks

Physical porosity in rocks, like shale and carbonate, has a large effect on the their storage capacity. The pore geometries also affect their permeability. Imaging the visible pore space provides…

Practical Applications of Broad Ion Beam Milling

Mechanical polishing can be time consuming and frustrating. It can also introduce unwanted artifacts when preparing cross-sectioned samples for electron backscatter diffraction (EBSD) in the scanning…

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자동차 분야

Leica는 최적의 이미징 솔루션을 제공하는 신뢰할 수 있는 파트너가 되어 고객이 경쟁에서 앞서 나갈 수 있기를 희망합니다.

재료 분석 현미경

재료 분석에는 금속 합금, 반도체, 유리 및 세라믹뿐만 아니라 플라스틱 및 폴리머와 같은 다양한 소재의 이미징, 측정 및 특성 분석을 위한 현미경 솔루션이 필요합니다.

산업용 현미경 시장

가동 시간을 최대화하고 목표를 달성하면 수익에 효율적으로 도움이 됩니다. Leica 현미경 솔루션은 가장 작은 샘플 세부 사항에 대한 통찰력을 제공할 뿐만 아니라 결과를 빠르고 안정적으로 분석, 문서화 및 보고할 수 있습니다. Leica Microsystems는 다양한 애플리케이션 요구 사항을 충족하는 데 도움이 되는 광범위한 솔루션과 전문가 지원을…

전자 장치의 단면 분석

전자 장치의 단면 분석을 통해 인쇄 회로 기판(PCB), 조립품(PCBA) 및 집적 회로(IC)와 같은 부품의 고장 메커니즘을 상세히 분석할 수 있습니다.
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