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10 May 2024

THUNDER 全国用户会

China Webinar
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Analyzing Non-metallic Inclusions in Steel

Oftentimes we find ourselves caught up in tedious analyses by reticle and comparison chart, time-consuming double-evaluation according to several standards or subjective inspection results with a bias…
Printed Circuit Board (PCB)

Performing Elemental Analysis down to the Micro Scale

If you work in electronic component analysis, you will be familiar with the many challenges posed. Whether you are identifying metallic particles or checking product authenticity, it’s important to…

Expanding the Limits of Electron Microscopy Sample Preparation

Capturing the intricate changes in fine structure or in cell dynamics with conventional cryo solutions can be challenging sometimes. Leica Microsystems has developed a new cryo platform, the Leica EM

Practical Applications of Broad Ion Beam Milling

Mechanical polishing can be time consuming and frustrating. It can also introduce unwanted artifacts when preparing cross-sectioned samples for electron backscatter diffraction (EBSD) in the scanning…
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