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Save Time

The Leica DVM6 digital microscope saves your team time throughout every step of the quality control and failure analysis workflow in the electronics, semiconductor, and microelectronic industries.

  • More flexibility to view all of your board to quickly identify causes of defects 
  • Magnification change in seconds to go from overview to detail
  • One click access to all information through intelligent software

This Science Lab article gives insight into the inspection and analysis of printed circuit boards with a digital microscope.

Magnification change in seconds

There are two ways to change magnification: either zooming or changing objectives. 

  • Three objectives  for 12x to 2,350x: The Leica DVM6 covers a magnification range from macro to micro with three objectives due to its enormous 16:1 zoom ratio. The advantage: Less objective changes save your team time
  • One hand changes objectives: With the Leica DVM6 users can swap objectives single-handedly. The change does not require any additional adjustments – users can hot-swap objectives and carry on working.
Wafer captured with different integrated contrasting options of the Leica DVM6
Images with open coaxial illumination, open coaxial illumination with relief contrast, and ring light illumination (first row: left to right)
Overview images with open coax and open coax with relief contrast (second row: left-right)

More details revealed

An image with the finest detail enables your team to find out what causes deviations more quickly. 

  • Superb optics: The Leica DVM6 objectives deliver excellent, true-color images, due to their apochromatic correction
  • Wide-angle tilting: Tilting the microscope head reveals details that would not be visible from inspecting the sample directly from above. This video shows how to easily get a different perspective on your sample
  • Multiple illumination modes: The method of illumination determines what can be seen in the image. Different illumination modes and the ability to combine them helps reveal more details.

Powerful software

The Leica Applications Suite (LAS) X software produces reliable, repeatable results, fast. It speeds up processes and reduces complex operations to a click of a button.  

  • Parameter recall: One click tells users the settings with which an image has been acquired. With recallable parameters, samples of the same kind can be imaged with the same settings quickly and easily.
  • User profiles: If several users share an instrument, unique user profiles help to set up inspections in seconds and ensure equality.
  • Intuitive design: The LAS X software guides users through their inspection tasks. It is designed for intuitive use, so that operators with little microscopy experience as well as experts in their field can all achieve the same results.

Learn about the role of digital microscopes in fast and reliable inspection of Printed Circuit Boards.

LAS X screen capture of a live view of a PCB, with 5° tilt and 20° stage rotation – encoding displayed in operation panel