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Leica DM2700 M Microscópio vertical de materiais com iluminação universal a LED

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Particulate contamination in between moving metal plates.

Key Factors for Efficient Cleanliness Analysis

An overview of the key factors necessary for technical cleanliness and efficient cleanliness analysis concerning automotive and electronics manufacturing and production is provided in this article.
Type of contamination: spores

Cleanliness Analysis for Particulate Contamination

Devices, products, and their components fabricated in many industries can be quite sensitive to contamination and, as a result, have stringent requirements for technical cleanliness. Measurement…

Challenges Faced When Manually Rating Non-Metallic Inclusions (NMIs) to Determine Steel Quality

Rapid, accurate, and reliable rating of non-metallic inclusions (NMIs) is instrumental for the determination of steel quality. This article describes the challenges that arise from manual NMI rating,…

Reasons Why There is Growing Need for Fast and Reliable Steel Quality Rating Solutions

Steel quality is critical for the manufacturing of high-quality components and products. Fast, reliable, and accurate detection and classification of inclusions has become essential for both component…

Top Issues Related to Standards for Rating Non-Metallic Inclusions in Steel

Supplying components and products made of steel to users worldwide can require that a single batch be compliant with multiple steel quality standards. This user demand creates significant challenges…

Rate the Quality of Your Steel: Free Webinar and Report

This webinar and report describe optimal microscopy solutions for rating steel quality in terms of non-metallic inclusions and reviews the various international and regional standards concerning…

Brief Introduction to Surface Metrology

This report briefly discusses several important metrology techniques and standard definitions commonly used to assess the topography of surfaces, also known as surface texture or surface finish. With…
Measuring grains size with Abrams Three-Circle Procedure.

How to Adapt Grain Size Analysis of Metallic Alloys to Your Needs

Metallic alloys, such as steel and aluminum, have an important role in a variety of industries, including automotive and transportation. In this report, the importance of grain size analysis for alloy…

Metalografia

Os microscópios metalográficos da Leica são otimizados para a análise microestrutural de metais, ligas e outros materiais.

Campos de aplicação

Classificação da qualidade do aço

Uma eficiência aprimorada para a classificação de inclusões não metálicas permite que fornecedores de aço e fabricantes industriais verifiquem a qualidade do aço em menos tempo, para garantir o…

Museus e conservação de arte

Analyzing, restoring, conserving and documenting artistic works or cultural artifacts require complex technical skills and the use of state-of-the-art imaging solutions, particularly contact-free,…

Processamento de pastilhas semicondutoras, embalagem, montagem e testes de circuitos integrados

Leica Microsystems’ customized, modular imaging solutions help suppliers and device manufacturers achieve fast and precise inspection and analysis for wafer processing, IC packaging, IC assembly, and…

Metalografia

Os microscópios metalográficos da Leica são otimizados para a análise microestrutural de metais, ligas e outros materiais.

Microscópios de inspeção

A Leica Microsystems oferece vários microscópios de inspeção para aplicações industriais. Nossos especialistas podem ajudá-lo a encontrar a solução ideal.

Mercados de microscopia industrial

Maximizar o tempo de atividade e atingir as metas de forma eficiente ajuda seu resultado final. As soluções de microscópio Leica podem fornecer uma visão dos menores detalhes da amostra, bem como…

Indústria metalúrgica

As soluções de microscopia da Leica para a indústria metalúrgica são úteis para avaliar a qualidade dos materiais e assegurar a conformidade com as normas aplicáveis.

Análise de cortes transversais para componentes eletrônicos

A análise de cortes transversais para componentes eletrônicos permite uma análise detalhada dos mecanismos de falha de componentes, como placas de circuito impresso (PCBs), conjuntos (PCBAs) e…
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