Leica EM UC7 Ultramicrótomo para seccionamento perfeito em temperatura ambiente e criogenia
Cross Section, Aluminum with OxidLayer
non embedded, sectioned with DIATOME diamond knife at room temperature, TEM image
Cross Section, Copper and Gold Layers
non embedded, sectioned with DIATOME diamond knife at room temperature, TEM image
Cross Section, Bismuth Telluride on glass substrate
embedded, sectioned with DIATOME diamond knife at room temperature
Cross Section, Si Wafer
embedded, sectioned with DIATOME diamond knife at room temperature, TEM image
Sodium Chloride
non embedded, dry sectioned with DIATOME diamond knife at room temperature
Gallium Arsenide
embedded, sectioned wth DIATOME diamond knife at room temperature
Section, Toner Powder
embedded, sectioned with DIATOME diamond knife at room temperature, TEM image
Section, Rubber Particles
sectioned with DIATOME diamond knife at low temperature, TEM image
Section ABS
OsO4stained, sectioned with DIATOME diamond knife at room temperature, HAADF, TEM image
Section, High Impact Polystyrene
OsO4stained, sectioned with DIATOME diamond knife at room temperature, HAADF, TEM image
Cross Section Surface, Razor Blade
non embedded, sectioned with DIATOME diamond knife at room temperature, SEM image
Cross Section Surface, Pre Paid Card
Ru04stained, sectioned with diamond knife at room temperture, treated with a special plasma etching device, SEM image