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Leica DM2700 M Microscopio vertical para el análisis de materiales con iluminación LED universal

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Particulate contamination in between moving metal plates.

Key Factors for Efficient Cleanliness Analysis

An overview of the key factors necessary for technical cleanliness and efficient cleanliness analysis concerning automotive and electronics manufacturing and production is provided in this article.
Type of contamination: spores

Cleanliness Analysis for Particulate Contamination

Devices, products, and their components fabricated in many industries can be quite sensitive to contamination and, as a result, have stringent requirements for technical cleanliness. Measurement…

Challenges Faced When Manually Rating Non-Metallic Inclusions (NMIs) to Determine Steel Quality

Rapid, accurate, and reliable rating of non-metallic inclusions (NMIs) is instrumental for the determination of steel quality. This article describes the challenges that arise from manual NMI rating,…

Reasons Why There is Growing Need for Fast and Reliable Steel Quality Rating Solutions

Steel quality is critical for the manufacturing of high-quality components and products. Fast, reliable, and accurate detection and classification of inclusions has become essential for both component…

Top Issues Related to Standards for Rating Non-Metallic Inclusions in Steel

Supplying components and products made of steel to users worldwide can require that a single batch be compliant with multiple steel quality standards. This user demand creates significant challenges…

Rate the Quality of Your Steel: Free Webinar and Report

This webinar and report describe optimal microscopy solutions for rating steel quality in terms of non-metallic inclusions and reviews the various international and regional standards concerning…

Brief Introduction to Surface Metrology

This report briefly discusses several important metrology techniques and standard definitions commonly used to assess the topography of surfaces, also known as surface texture or surface finish. With…
Measuring grains size with Abrams Three-Circle Procedure.

How to Adapt Grain Size Analysis of Metallic Alloys to Your Needs

Metallic alloys, such as steel and aluminum, have an important role in a variety of industries, including automotive and transportation. In this report, the importance of grain size analysis for alloy…

Metalografía

Los microscopios metalográficos de Leica se han optimizado para analizar la microestructura de metales, aleaciones y otros materiales.

Campos de aplicación

Clasificación de la calidad del acero

La eficiencia mejorada para la clasificación de inclusiones no metálicas permite a los proveedores de acero y a los fabricantes industriales verificar la calidad del acero en menos tiempo a fin de…

Microscopios para conservación de arte

Analizar, restaurar, conservar y documentar obras de arte u objetos culturales requiere aptitudes técnicas complejas y el uso de soluciones de adquisición de imágenes de vanguardia, en especial…

Semiconductores: Fabricación de obleas

Leica Microsystems’ customized, modular imaging solutions help suppliers and device manufacturers achieve fast and precise inspection and analysis for wafer processing, IC packaging, IC assembly, and…

Metalografía

Los microscopios metalográficos de Leica se han optimizado para analizar la microestructura de metales, aleaciones y otros materiales.

Microscopios de inspección

Leica Microsystems ofrece una variedad de microscopios de inspección para aplicaciones industriales. Nuestros expertos pueden ayudarle a encontrar la solución óptima.

Mercados de microscopía industrial

Maximizar el tiempo de actividad y alcanzar los objetivos de forma eficiente ayudan a su cuenta de resultados. Las soluciones de microscopía de Leica le permiten conocer hasta el más mínimo detalle de…

Industria metalúrgica

Los microscopios de Leica para la industria metalúrgica son útiles para evaluar la calidad de los materiales y garantizar el cumplimiento con la normativa aplicable.

Análisis de cortes transversales para la microelectrónica

El análisis de sección transversal para la electrónica permite un análisis detallado de los mecanismos de fallo de componentes como placas de circuito impreso (PCB), montajes (PCBA) y circuitos…
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