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Leica DM8000 M Sistema de inspección y revisión de 8" de alto rendimiento

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Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.

Rapid Semiconductor Inspection with Microscope Contrast Methods

Semiconductor inspection for QC of materials like wafers can be challenging. Microscope solutions that offer several contrast methods enable fast and reliable defect detection and efficient workflows.
Wafer

How to Boost your Microelectronic Component Inspection Performance

Do you need to see more when inspecting silicon wafers or MEMS? Would you like to get sharp and detailed sample images which are similar to those from electron microscopes? Watch this free webinar…

Brief Introduction to Surface Metrology

This report briefly discusses several important metrology techniques and standard definitions commonly used to assess the topography of surfaces, also known as surface texture or surface finish. With…

Campos de aplicación

Semiconductores: Fabricación de obleas

Leica Microsystems’ customized, modular imaging solutions help suppliers and device manufacturers achieve fast and precise inspection and analysis for wafer processing, IC packaging, IC assembly, and…

Mercados de microscopía industrial

Maximizar el tiempo de actividad y alcanzar los objetivos de forma eficiente ayudan a su cuenta de resultados. Las soluciones de microscopía de Leica le permiten conocer hasta el más mínimo detalle de…
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