EM TXP Dispositivo de corte transversal
El punto de partida para el corte transversal de muestras para su examen mediante microscopía electrónica y óptica.
Learn more about the Leica EM TXP Target surfacing System
The Leica EM TXP is a unique target preparation device especially developed for cutting, milling, drilling, grinding and polishing samples prior to examination by SEM, TEM and LM techniques.