Fresa per taglio inclinato a fascio ionico Leica EM TIC 3X

Reproducible results by Ion Milling

The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.

With the EM TIC 3X you achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near native state as possible.

As convenient as never before!

Flexible system – Adaptable to your needs at any time 

The flexible choice of stages makes the EM TIC 3X a perfect instrument not only for high through-put but also for contract laboratories. Depending on your needs the EM TIC 3X can be configured individually using interchangeable stages:

• Standard stage
• Multiple sample stage
• Rotary stage
• Cooling stage or
• Vacuum Cryo Transfer Docking Station

for applications of standard preparation, high throughput processing, as well as the preparation of extremely heat sensitive samples such as polymers, rubbers or biological materials at low temperatures.

Standard Workflow Solution - Create synergies with the EM TXP 

Prior to use of the EM TIC 3X, mechanical preparation is often required to get as close as possible to the area of interest. The EM TXP is a unique target surfacing system developed for cutting and polishing samples prior to follow-on techniques with instruments such as the EM TIC 3X.

The EM TXP is specially designed to pre-prepare samples by sawing, milling, grinding, and polishing.  It excels with challenging specimens where pinpointing and preparing difficult targets becomes easy.