Leica EM TXP ターゲット断面試料作製装置


Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.

Cross-section Analysis for Electronics Manufacturing

Cross-section analysis for electronics concerning quality control and failure analysis of printed circuit boards (PCBs) and assemblies (PCBAs), integrated circuits (ICs), etc. are described in this…
Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.

Structural and Chemical Analysis of IC-Chip Cross Sections

This article shows how electronic IC-chip cross sections can be efficiently and reliably prepared and then analyzed, both visually and chemically at the microscale, with the EM TXP and DM6 M LIBS…
EBSD grain size distribution of the cross section of a gold wire within a silicon matrix from inside a CPU (central processing unit of a computer). The grains are highlighted with arbitrary colors.

High-Quality EBSD Sample Preparation

This article describes a method for EBSD sample preparation of challenging materials. The high-quality samples required for electron backscatter diffraction are prepared with broad ion-beam milling.
SEM image of the full Li-NMC electrode sample, showing the two porous layers and the metal film at the center of the structure.

Cross Section Ion Beam Milling of Battery Components

Sample Preparation of Lithium battery systems requires high quality surface preparation to evaluate their internal structure and morphology. Due to the brittle materials involved, preparing pristine…

Workflow Solutions for Sample Preparation Methods for Material Science

This brochure presents and explains appropriate workflow solutions for the most frequently required sample preparation methods for material science samples.











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