Wolfgang Grünewald , PhD
- Has a PhD in experimental physics, Department of Physics, Technical University of Chemnitz, Germany
- In his diploma and dissertation, he dealt with TEM investigation of thin films and ion milling as appropriate sample preparation method
- Worked 12 years as application manager at Bal-Tec, in development of ion milling systems and preparation methods
- Since 2008, worldwide specialist for Solid States sample preparation within Leica Microsystems
- Owner of 5 patents and author of many scientific publications
3-Dimensional Imaging of Macroscopic Defects in Aluminum Alloys
The investigation of macroscale defects in aluminum (Al) alloys with a rapid 3-dimensional (3D) imaging approach is described in this report. Aluminum (Al) alloys play an important role in the…Read article
Quick 3D imaging of alloy defects
Aluminum (Al) alloys play an important role in the production of aircraft and vehicles, as well as products in other industries. Defects present in the Al alloy used for the production of aircraft,…Read articleContrast Enhancement of Polycrystalline Metals - Sample Preparation for SEM
Application Note - Ion milling is a perfect alternative for chemical etching, especially for polycrystalline metals, such as copper. Ion milling can be used to increase the contrast of the grain…Read article
Cross Sectioning of Cadmiumsulphide (CdS) for Cathodoluminescence
Cathodoluminescence can be used to achieve spectra and high resolution images of impurity and structural defects in semicondoctors, minerals and insulating materials. This application note explains…Read article
Cross Sectioning of Copper for Electron Backscattered Diffraction (EBSD)
Application Note for Leica EM TIC 3X - Electron Backscattered Diffraction (EBSD) is a surface technique creating diffraction patterns (Kikuchi-bands). It can be used for crystal orientation mapping,…Read article
Porous Ceramics - Sample Preparation for SEM
Application Note for Leica EM RES102 - Ceramic membrane filters with pore sizes down to a few nanometres must be investigated in cross-section with regard to the structure of the pores. The smallest…Read article
Removal of Surface Layers - Sample Preparation for SEM and TEM
Application Note for Leica EM RES102 - Sometimes it is necessary to remove surface layers to gain access to the real surface structure. That can be a native oxide, or layers coming from the…Read article
Cross Section of Solar Cells
Application Note for Leica EM TIC020, Leica EM TIC 3X - Cross section of a complete solar cell.Read article
Cross Sectioning of a Multilayer System - Preparation of a Perfect Sample Surface for EBSD
Application Note for Leica EM TIC 3X - Electron Backscattered Diffraction (EBSD) is a surface technique creating a diffraction pattern (Kikuchi-bands). It can be used for crystal orientation mapping,…Read article
Multilayer Systems with Widely Different Sputter Rates - Sample Preparation for TEM
Application Note for Leica EM RES102 - The multi-layer system to be prepared in cross-section consists of a Si substrate, a TiN layer with a thickness of a few nm and a 500 nm W layer. All these…Read article![High resolution XTEM lattice [110] image of conventional prepared InP](https://webcdn.leica-microsystems.com/fileadmin/_processed_/b/b/csm_Compound_3_525d192774.jpg "In-Containing Compound Semiconductors - Sample Preparation for TEM")
In-Containing Compound Semiconductors - Sample Preparation for TEM
Application Note for Leica EM RES102 - Previous studies showed that surface accumulation of In occurs when InP was milled in a conventional way with Ar ions. The consequence is In islands on the…Read article
"Shallow Trench Isolation" Structures - Sample Preparation for TEM
Application Note for Leica EM RES102 - The cross-sectional preparation of structured semiconductor materials requires a very thorough mechanical pre-preparation. In doing this, it must be ensured that…Read article
Paper Samples - Sample Preparation for SEM
Application Note for Leica EM RES102 - A coated paper sample has been prepared with ion beam slope cutting in order to test the procedure with regard to its applicability. With the use of ion beam…Read article
Metal Films and Sheets - Sample Preparation for TEM
Application Note for Leica EM RES102 - Most metal films already have a thickness that requires no further mechanical pre-preparation. Frequently, however, they are also domed, which can lead to…Read article
Contrast Enhancement of Polished Cross Sections of Semiconductor Structures - Sample Preparation for SEM
Application Note for Leica EM RES102 - The surfaces of polished cross sections often show fine scratches and residues of the removed material or of the abrasive material. The artefacts are strongly…Read article
Surface Modification of ZnAg Sample - Sample Preparation for SEM
Application Note for Leica EM RES102 - By means of cleaning, polishing and contrast enhancement a soft ZnAg sample should be prepared to obtain information concerning the grain structure and…Read article
Cross Sectioning of Ni/Cu on Steel for EBSD
Application Note for Leica EM TIC 3X - Electron Backscattered Diffraction (EBSD) is a surface technique creating a diffraction pattern (Kikuchi-bands). It can be used for crystal orientation mapping,…Read article
Cross Sectioning of Painted Concrete
Application Note for Leica EM TIC 3X - Ion beam slope cutting is a method that can achieve flat cuts of material combinations consisting of hard and soft materials. Here, cross sectioning of painted…Read article