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Leica DM8000 M High Throughput 8" Inspection & Review System

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Images of the same area of a processed wafer taken with standard (left) and oblique (right) brightfield illumination using a Leica compound microscope. The defect on the wafer surface is clearly more visible with oblique illumination.

Rapid Semiconductor Inspection with Microscope Contrast Methods

Semiconductor inspection for QC of materials like wafers can be challenging. Microscope solutions that offer several contrast methods enable fast and reliable defect detection and efficient workflows.
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How to Boost your Microelectronic Component Inspection Performance

Do you need to see more when inspecting silicon wafers or MEMS? Would you like to get sharp and detailed sample images which are similar to those from electron microscopes? Watch this free webinar…

Brief Introduction to Surface Metrology

This report briefly discusses several important metrology techniques and standard definitions commonly used to assess the topography of surfaces, also known as surface texture or surface finish. With…

Fields of Application

Semiconductor Wafer Processing, IC Packaging & Testing

Leica Microsystems’ customized, modular imaging solutions help suppliers and device manufacturers achieve fast and precise inspection and analysis for wafer processing, IC packaging, IC assembly, and…

Industrial Microscopy Markets

Maximizing uptime and achieving targets efficiently help your bottom line. Leica microscope solutions can give you insights into the smallest sample details as well as analyze, document, and report…
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