Robert Ranner

Robert Ranner

Robert Ranner, Product Manager EM Specimen Preparation at Leica Microsystems, Nanotechnology Division. He is responsible for solid state preparation instruments. Robert has ten years application experience in industrial sample preparation for TEM, SEM.

Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.

Structural and Chemical Analysis of IC-Chip Cross Sections

This article shows how electronic IC-chip cross sections can be efficiently and reliably prepared and then analyzed, both visually and chemically at the microscale, with the EM TXP and DM6 M LIBS
Ultramicrotomy; ARTOS 3D

Introduction to Ultramicrotomy

When studying samples, to visualize their fine structure with nanometer scale resolution, most often electron microscopy is used. There are 2 types: scanning electron microscopy (SEM) which images the…

Array Tomography for SEM 3D Reconstruction

Array tomography (AT) is a 3D image reconstruction technique for high resolution, quantitative analysis of biological structures. For optimal results, ultrathin and ordered sections are an absolute…
Array tomography image of T-cells in mouse lymph nodes.

High Resolution Array Tomography with Automated Serial Sectioning

The optimization of high resolution, 3-dimensional (3D), sub-cellular structure analysis with array tomography using an automated serial sectioning solution, achieving a high section density on the…

Practical Applications of Broad Ion Beam Milling

Mechanical polishing can be time consuming and frustrating. It can also introduce unwanted artifacts when preparing cross-sectioned samples for electron backscatter diffraction (EBSD) in the scanning…

Brief Introduction to Specimen Trimming

Before ultrathin sectioning a sample with an ultramicrotome it has to be pre-prepared. For this pre-preparation, special attention must be paid to the sample size (size of the section), location of…
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