Leica EM TXP Target Surfacing System

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Preparation of an IC-chip cross section: grinding and polishing of the chip cross section.

Cross-section Analysis for Electronics Manufacturing

Cross-section analysis for electronics concerning quality control and failure analysis of printed circuit boards (PCBs) and assemblies (PCBAs), integrated circuits (ICs), etc. are described in this…
Image of an integrated-circuit (IC) chip cross section acquired at higher magnification showing a region of interest.

Structural and Chemical Analysis of IC-Chip Cross Sections

This article shows how electronic IC-chip cross sections can be efficiently and reliably prepared and then analyzed, both visually and chemically at the microscale, with the EM TXP and DM6 M LIBS…
EBSD grain size distribution of the cross section of a gold wire within a silicon matrix from inside a CPU (central processing unit of a computer). The grains are highlighted with arbitrary colors.

High-Quality EBSD Sample Preparation

This article describes a method for EBSD sample preparation of challenging materials. The high-quality samples required for electron backscatter diffraction are prepared with broad ion-beam milling.
SEM image of the full Li-NMC electrode sample, showing the two porous layers and the metal film at the center of the structure.

Cross Section Ion Beam Milling of Battery Components

Sample Preparation of Lithium battery systems requires high quality surface preparation to evaluate their internal structure and morphology. Due to the brittle materials involved, preparing pristine…

Workflow Solutions for Sample Preparation Methods for Material Science

This brochure presents and explains appropriate workflow solutions for the most frequently required sample preparation methods for material science samples.

Fields of Application

Watchmaking Industry

Reflections are reduced with diffusers or polarization sets. Work smoothly and uninterruptedly with fast images from our digital microscope cameras with frame rates of up to 30 fps that provide crisp,…

Automotive & Transportation

We at Leica want to be your dependendable collaborators, guiding you to optimal imaging solutions for automotive and transportation, so you can stay ahead of the competition. Our smart imaging…

Material Analysis Microscopes

Materials analysis requires microscope solutions for the imaging, measurement, and analysis of features across a variety of materials like metal alloys, semiconductors, glass and ceramics, as well as…

Industrial Microscopy Markets

Maximizing uptime and achieving targets efficiently help your bottom line. Leica microscope solutions can give you insights into the smallest sample details as well as analyze, document, and report…

Cross-Section Analysis for Electronics

Cross-section analysis for electronics enables detailed analysis of failure mechanisms of components like printed circuit boards (PCBs), assemblies (PCBAs), and integrated circuits (ICs).
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